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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立中山大學 2009 Why fine pitch copper wire bonding now? B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學 2009 Underfill study for large dice flip chip packages A. Lin;C.Y. Li;M.K. Shih;Y.S. Lai;B. Appelt;A. Tseng
國立中山大學 2009 Why fine pitch copper wire bonding now? B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學 2009 Fine pitch copper wire bonding – why now? B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學 2009 Gold stud bumps for high performance flip chip packages W. Chen;K. Shen;A. Wang;Y.S. Lai;B. Appelt;A. Tseng
國立中山大學 1999-09 Electrical modeling of enhanced ball grid array packages using coupled transmission lines T.S. Horng;S.M. Wu; A. Tseng; H.H. Huang
國立中山大學 1999 Electrical modeling of enhanced ball grid array packages using coupled transmission lines T.S. Horng;S.M. Wu;A. Tseng;H.H. Huang
國立中山大學 1998 Comparison of advanced measurement and modeling techniques for electrical characterization of BGAs T.S. Horng;S.M. Wu;H.H. Huang;A. Tseng;J.J. Lee

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