臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立中山大學	2009	Why fine pitch copper wire bonding now?	B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學	2009	Underfill study for large dice flip chip packages	A. Lin;C.Y. Li;M.K. Shih;Y.S. Lai;B. Appelt;A. Tseng
國立中山大學	2009	Why fine pitch copper wire bonding now?	B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學	2009	Fine pitch copper wire bonding – why now?	B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學	2009	Gold stud bumps for high performance flip chip packages	W. Chen;K. Shen;A. Wang;Y.S. Lai;B. Appelt;A. Tseng
國立中山大學	1999-09	Electrical modeling of enhanced ball grid array packages using coupled transmission lines	T.S. Horng;S.M. Wu; A. Tseng; H.H. Huang
國立中山大學	1999	Electrical modeling of enhanced ball grid array packages using coupled transmission lines	T.S. Horng;S.M. Wu;A. Tseng;H.H. Huang
國立中山大學	1998	Comparison of advanced measurement and modeling techniques for electrical characterization of BGAs	T.S. Horng;S.M. Wu;H.H. Huang;A. Tseng;J.J. Lee

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