English  |  正體中文  |  简体中文  |  0  
???header.visitor??? :  52554758    ???header.onlineuser??? :  821
???header.sponsordeclaration???
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
???ui.leftmenu.abouttair???

???ui.leftmenu.bartitle???

???index.news???

???ui.leftmenu.copyrighttitle???

???ui.leftmenu.link???

"bing yuan"???jsp.browse.items-by-author.description???

???jsp.browse.items-by-author.back???
???jsp.browse.items-by-author.order1??? ???jsp.browse.items-by-author.order2???

Showing items 1-6 of 6  (1 Page(s) Totally)
1 
View [10|25|50] records per page

Institution Date Title Author
國立成功大學 2024-10-27 Preparing remote states for genuine quantum networks Chen;Shih-Hsuan;Hsu;Chan;Kao;Yu-Chien;Lee;Bing-Yuan;Liu;Yuan-Sung;Chen;Yueh-Nan;Li;Che-Ming
國立成功大學 2024-10 Analysis of flip-chip ball grid array underfill flow process Hung;Hao-Hsi;Cheng;Yu-Chi;Hwang;Sheng-Jye;Chen;Dao-Long;Chang;Hui-Jing;Huang;Bing-Yuan;Huang;Hung-Hsien;Wang;Chen-Chao;Hung;Chih-Pin
國立成功大學 2024-09 Effect of flip-chip ball grid array structure on capillary underfill flow Hung;Hao-Hsi;Cheng;Yu-Chi;Hwang;Sheng-Jye;Chang;Hui-Jing;Huang;Bing-Yuan;Huang;Hung-Hsien;Chen;Dao-Long;Wang;Chen-Chao;Hung;Chih-Pin
國立成功大學 2024-08 Accurate numerical simulations of capillary underfill process for flip-chip packages Cheng;Yu-Chi;Chen;Yu-Hsien;Hung;Hao-Hsi;Hwang;Sheng-Jye;Chen;Dao-Long;Chang;Hui-Jing;Huang;Bing-Yuan;Huang;Hung-Hsien;Wang;Chen-Chao;Hung;Chih-Pin
國立成功大學 2024-04-30 Brood success of sex-role-reversed pheasant-tailed jacanas: the effects of social polyandry, seasonality, and male mating order Lee;Ya-Fu;Kuo;Yen-Min;Chuang;Bing-Yuan;Hsu;Hui-Ching;Huang;Yi-Jun;Su;Yu-Chen;Lee;Wen-Chen
國立成功大學 2022-01 Epoxy Molding Compound Filler Clogging Simulation During Integrated Circuit Encapsulation Process Chen;Bo-Heng;Hwang;Sheng-Jye;Chang;Yu-Yang;Yang;Yu-Shuo;Lee;Huei-Huang;Huang;Bing-Yuan;Hu;Ian;Chen;Dao-Long;Tarng;David;Hung;C, P.

Showing items 1-6 of 6  (1 Page(s) Totally)
1 
View [10|25|50] records per page