臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立成功大學	2024-12	17-4 Precipitation-Hardening Stainless Steel: Soft-Tough Heat Treatment Mechanism and Thermal Fatigue Characteristics	Hsieh;Ping-Yu;Wu;Bo-Ding;Hung;Fei-Yi
國立成功大學	2024-12	Study on Material Properties and Copper-to-Copper Wire Bonding of Cu-Pt-Au-Pd Fine Micro-Alloyed Wires	Chang;Yi-Tze;Hung;Fei-Yi;Wu;Bo-Ding
國立成功大學	2024-11	Investigation on the microstructure, mechanical properties and chlorine resistance of fine aluminum alloy wires	Wu;Bo-Ding;Hung;Fei-Yi;Hsu;Keng-Yi
國立成功大學	2024-11	500 μm heavy micro-alloyed Cu wire for IGBT application: The study on microstructure characteristics, electrical fatigue fracture mechanism and bonding reliability	Wu;Bo-Ding;Hung;Fei-Yi;Chan;Kang-Pei
國立成功大學	2024-11	Effect of electro-thermal diffusion induced deterioration on the failure mechanism of Pd-Au-coated Cu wires	Wu;Bo-Ding;Hsu;Chung-Kai;Huang;Bo-Chin;Hung;Fei-Yi
國立成功大學	2024-05	Mechanisms of electrical fatigue and oxidation corrosion failure of micro-alloyed copper wire	Wu;Bo-Ding;Hung;Fei-Yi;Chang;Kai-Chieh
國立成功大學	2024-04	Comparison of the Microstructural Characteristics and the Electrothermal Fracture Mechanism of Au-Pd-Coated Copper Wire and Cu-Ti Micro-alloyed Wire	Chang;Yi-Tze;Hung;Fei-Yi;Wu;Bo-Ding
國立成功大學	2023-05	Study of tensile properties, electrothermal characteristics and packaging reliability on Cu-Pt-Au-Pd fine micro-alloyed wire	Hsu;Shen-Teng;Hung;Fei-Yi;Wu;Bo-Ding
國立成功大學	2022-12	The electrothermal fracture mechanism between aluminum and copper wires	Wu;Bo-Ding;Hung;Fei-Yi
國立成功大學	2021-09	Effect of electrification and chlorination on the microstructure and electrical properties of fine Al wires	Wu;Bo-Ding;Hung;Fei-Yi

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