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Institution Date Title Author
元智大學 2014-10-22 Unusual Cu Depletion in Line-bump Solder Joints under Current Stressing Cheng-En Ho; Cheng-Hsien Yang; Wan-Zhen Hsieh; Bo-Zong Chen
元智大學 2011 電遷移對不同銀成份之晶片接點的可靠度影響評估 陳柏宗; Bo-Zong Chen
元智大學 2010-12 Critical Current Density of Inhibiting (Cu,Ni)6Sn5 Formation on the Ni side of Cu/Solder/Ni Joints Wei-Hsiang Wu; Han-Lin Chung; Bo-Zong Chen; Cheng-En Ho
元智大學 2010-11 錫在Cu6Sn5介金屬相之電遷移行為之研究 Bo-Zong Chen; Yen-Chen Lin; Han-Lin Chung; Cheng-En Ho

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