臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立屏東大學	2010	Joint Optimization of Energy Allocation and Routing Problems in Wireless Sensor Networks	王朱福;J.W.Ding;C.C.Lee
國立屏東大學	2010	The Optimization of Sensor Relocation in Wireless Mobile Sensor Networks	王朱福;C.F.Wang;C.C.Lee
亞洲大學	2009-09	Pernatal diagnosis of partial trisomy 14q (14q31.1->qter) and partial monosomy 5p (5p13.2->pter) associated with polyhydramnios, short limbs, micropenis and brain malformations	陳持平;Chen, Chih-Ping;Chern, Schu-Rern;F.J.Tsai;C.C.Lee;L.F.Chen;W.Wang
國立臺灣海洋大學	2009-05	An OFDM-based Underwater Acoustic Multimedia Transmission Scheme	C. F. Lin;C.H. Shih;C.P. Chen;C.C. Lee;S.W. Leu;J.K. Wu;C.H. Tseng;H.S. Hung;F.S. Lu;I. A. Parinov;S.H. Chang
育達商業科技大學	2009	Reversible Data Hiding Using High-Peak Prediction Errors	C.L. Liu;C.C. Lee;D.C. Lou;W. Hong;J. Chen;C.W. Shiu
國立高雄師範大學	2009	The major source and impact of phenyltin contamination of freshwater aquaculture clam Corbicula fluminea and wild gold apple snail Pomacea canaliculata	陳士賢;田倩蓉; C. C. Lee;Y. F. Jhuang;L. L. Liu;C. Y. Hsieh;Colin S. Chen;Chien-Jung Tien
國立中山大學	2009	Influence of power cycling durations on thermal and fatigue reliability characteristics of board-level chip-scale packages	T.H. Wang;C.C. Lee;Y.S. Lai;K.Y. Lee
國立中山大學	2009	Coupled power and thermal cycling reliability of board-level package-on-package stacking assembly	T.H. Wang;Y.S. Lai;C.C. Lee;Y.C. Lin
國立中山大學	2009	Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber	T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai
國立中山大學	2009	Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber	T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai

Showing items 31-40 of 104 (11 Page(s) Totally)
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