臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	Repositories
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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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	臺大學術典藏NTU Scholars

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Institution	Date	Title	Author
元智大學	Mar-20	Significantly Improving the Etching Characteristics of Electroplated Cu Films through Microstructure Modification	C. Y. Lee; P. C. Lin; C. H. Yang; Cheng-En Ho
元智大學	Mar-16	Real-time X-ray microscopy study of electromigration in microelectronic solder joints	Cheng-En Ho; C. H. Yang; P. T. Lee; C. T. Chen
元智大學	Mar-16	Real-time X-ray microscopy study of electromigration in microelectronic solder joints	Cheng-En Ho; C. H. Yang; P. T. Lee; C. T. Chen
元智大學	Mar-16	Real-time X-ray microscopy study of electromigration in microelectronic solder joints	Cheng-En Ho; C. H. Yang; P. T. Lee; C. T. Chen
元智大學	Jun-19	Nanoindentation Study of Single-Crystalline and (101)-Oriented Nanotwinned Cu	C. H. Yang; C. Y. Lee; B. C. Huang; P. C. Lin; Cheng-En Ho
元智大學	Dec-15	Formation Mechanism of Pinholes in Electroplated Cu Films and Its Mitigation	C. C. Chen; C. H. Hsieh; Y. W. Lee; C. H. Yang; Cheng-En Ho
元智大學	Dec-15	Abnormal Depletion of Cu Metallization Pads in Line-bump-line Solder Joints under Electron Current Stressing	Cheng-En Ho; C. H. Yang; C. T. Chen; B. Z. Chen
元智大學	Aug-20	Influence of Pd(P) Thickness on the Pd-free Solder Reaction between Eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu Multilayer	C. Y. Lee; S. P. Yang; C. H. Yang; M. K. Lu; T. T. Kuo; Cheng-En Ho
元智大學	Apr-19	In-situ characterization of the microstructure transition of electroplating Cu during self-annealing and its effect on the substrate warpage	C. H. Yang; S. P. Yang; B. C. Huang; C. Y. Lee; H. C. Liu; Cheng-En Ho
元智大學	Apr-17	Eco-efficient Synthesis of Highly Porous CoCO3 Anodes for Li+ and Na+ Storage Using Supercritical CO2 Precursors	H.-Y. Li; C.-M. Tseng; C.-H. Yang; T.-C. Lee; C.-Y. Su; Chien-Te Hsieh; J.K. Chang

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