臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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机构	日期	题名	作者
元智大學	2021/12/21	3D Electromagnetic Simulation and VNA Measurements of Signal Transmission Loss of Cu Interconnects at 1–100 GHz: Surface Finish Effect	C. J. Yu; H. W. Tseng; S. Kao; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/12/21	3D Electromagnetic Simulation and VNA Measurements of Signal Transmission Loss of Cu Interconnects at 1–100 GHz: Surface Finish Effect	C. J. Yu; H. W. Tseng; S. Kao; C. Y. Lee; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	Electromagnetic Simulation and VNA Measurements of Surface Finish Effect on the Cu Interconnect Transmission Characteristics at 1–100 GHz	J. C. Yu; H. W. Tseng; C. Y. Lee; P. C. Hsu; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	Improvement of High-frequency Transmission Performance through Copper Microstructure Modification	C. Y. Lee; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	Electromagnetic Simulation and VNA Measurements of Surface Finish Effect on the Cu Interconnect Transmission Characteristics at 1–100 GHz	J. C. Yu; H. W. Tseng; C. Y. Lee; P. C. Hsu; Chien-Chang Huang; Cheng-En Ho
元智大學	2021/11/13	COMSOL-Multiphysics Simulation of Current Density and Electrolyte Distributions in Cu Pillar Fabrication	P. T. Lee; C. H. Chang; C. Y. Lee; Y. L. Chen; Cheng-En Ho
元智大學	2021/11/13	Improvement of High-frequency Transmission Performance through Copper Microstructure Modification	C. Y. Lee; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學	2020/11/7	Thermal Stability and Electrochemical Corrosion of ENEPIG Surface Finish Deposited on the Cu Traces	C. Y. Lee; W. Z. Hsieh; P. T. Lee ; C. H. Li; S. P. Yang; Cheng-En Ho
元智大學	2020/11/7	Microstructure Modification of Copper Interconnects and Its Elongation at Break	C. Y. Lee; C. P. Pan; Y. M. Lin; Y. C. Chiang; Cheng-En Ho
元智大學	2020/11/7	Morphological Transition of Cu6Sn5 and Cu3Sn Induced by Surface Finish and Its Mechanical Reliability of Solder Joints	C. H. Li; C. Y. Lee; S. P. Yang; C. C. Chen; T. T. Kuo; Cheng-En Ho

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