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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
元智大學 Aug-20 Influence of Pd(P) Thickness on the Pd-free Solder Reaction between Eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu Multilayer C. Y. Lee; S. P. Yang; C. H. Yang; M. K. Lu; T. T. Kuo; Cheng-En Ho
元智大學 Apr-19 In-situ characterization of the microstructure transition of electroplating Cu during self-annealing and its effect on the substrate warpage C. H. Yang; S. P. Yang; B. C. Huang; C. Y. Lee; H. C. Liu; Cheng-En Ho
元智大學 2023/10/25 Electromigration Reliability of Micro Joints with Different Surface Finishes Z. Y. Yang; S. C. Chang; C. T. Chen; W. Z. Hsieh; C. Y. Lee; H. C. Liu; K. H. Lan; P. C. Lin; Cheng-En Ho
元智大學 2023/10/25 Improving Uniformity of Electroplated Cu for TGV Metallization Y. M. Lin; P. Y. Yeh; C. Y. Lee; K. H. Lin; C. C. Wang; Cheng-En Ho
元智大學 2022-11-18 Electromigration-induced Abnormal Phase Transformation and Massive IMC Propagation in Micro Joints C. Y. Lee; Y. C. Chiang; C. T. Chen; Cheng-En Ho
元智大學 2022-10-26 Electromigration Reliability of Micro Joints with Au/Pd(P)/Ni(P)/Cu Pads C. Y. Lee; S. C. Chang; C. T. Chen; H. C. Liu; K. H. Lan; P C. Lin; Cheng-En Ho
元智大學 2021/5/12 White X-ray Nanodiffraction Study of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5 P. T. Lee; W. Z. Hsieh; C. Y. Lee; C. R. Kao; Cheng-En Ho
元智大學 2021/12/21 Microstructure Modification of Copper Interconnects and Their Transmission Losses at 1–40 GHz C. Y. Lee; S. Kao; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho
元智大學 2021/12/21 Crystal Coherency between Electroplated Cu Fillings and Substrate in A Stacked-via Structure Y. M. Lin; H. C. Liu; C. Y. Lee; C. S. Hsieh; K. H. Lan; P. C. Lin; Cheng-En Ho
元智大學 2021/12/21 Microstructure Modification of Copper Interconnects and Their Transmission Losses at 1–40 GHz C. Y. Lee; S. Kao; J. C. Yu; Y. K. Hsiung; H. W. Tseng; Chien-Chang Huang; Cheng-En Ho

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