|
English
|
正體中文
|
简体中文
|
總筆數 :0
|
|
造訪人次 :
52276722
線上人數 :
810
教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
|
|
|
"duh jg"的相關文件
顯示項目 31-43 / 43 (共2頁)
<< < 1 2
每頁顯示[10|25|50]項目
| 國立交通大學 |
2014-12-08T15:05:31Z |
RUTHERFORD BACKSCATTERING SPECTROSCOPY ANALYSIS OF AR+ IMPLANTED YTTRIA STABILIZED ZIRCONIA
|
DUH, JG; WU, YS; CHOUI, BS |
| 國立交通大學 |
2014-12-08T15:05:19Z |
TEMPERATURE CYCLING EFFECTS BETWEEN SN/PB SOLDER AND THICK-FILM PD/AG CONDUCTOR METALLIZATION
|
CHIOU, BS; LIU, KC; DUH, JG; PALANISAMY, PS |
| 國立交通大學 |
2014-12-08T15:05:15Z |
SINTERING BEHAVIOR AND DIELECTRIC CHARACTERISTICS OF LITAO3 WITH THE ADDITION OF (MG2+TIO2)
|
CHIOU, BS; LIN, TY; DUH, JG |
| 國立交通大學 |
2014-12-08T15:05:10Z |
DEVELOPMENT OF TEMPERATURE-STABLE THICK-FILM DIELECTRICS .3. ROLE OF GLASS ON THE MICROSTRUCTURE EVOLUTION OF A THICK-FILM DIELECTRIC
|
CHIOU, BS; LIU, KC; DUH, JG; CHUNG, MC |
| 國立交通大學 |
2014-12-08T15:04:53Z |
THE EFFECT OF APPLIED FREQUENCIES AND MULTIPLE FIRING ON THE RESISTANCE OF THICK-FILM RESISTORS
|
CHIOU, BS; HSU, WY; DUH, JG |
| 國立交通大學 |
2014-12-08T15:04:52Z |
A SALT SPRAY TEST ON INTERLAYER-MODIFIED TIN COATING
|
CHEN, YI; DUH, JG; CHIOU, BS; YANG, TJ |
| 國立交通大學 |
2014-12-08T15:04:31Z |
METALLIZATION OF ALUMINUM NITRIDE SUBSTRATES BY ELECTROLESS COPPER PLATING
|
CHIOU, BS; CHANG, JH; DUH, JG |
| 國立交通大學 |
2014-12-08T15:04:21Z |
CORROSION BEHAVIOR OF ELECTROLESS NICKEL-PLATING MODIFIED TIN COATING
|
DOONG, JC; DUH, JG; TSAI, SY; WANG, JH; CHIOU, BS |
| 國立交通大學 |
2014-12-08T15:04:16Z |
MORPHOLOGY AND ADHESION STRENGTH IN ELECTROLESS CU METALLIZED ALN SUBSTRATE
|
CHANG, JH; DUH, JG; CHIOU, BS |
| 國立交通大學 |
2014-12-08T15:04:15Z |
FABRICATION AND PROPERTIES OF ALUMINO-BORO-SILICATE GLASS-CERAMIC SYSTEMS
|
CHIOU, BS; TZENG, JM; DUH, JG |
| 國立交通大學 |
2014-12-08T15:03:30Z |
LIQUID-PHASE BONDING OF YTTRIA-STABILIZED ZIRCONIA WITH CAO-TIO2-SIO2 GLASS
|
CHIOU, BS; YOUNG, CD; DUH, JG |
| 國立交通大學 |
2014-12-08T15:03:14Z |
METALLURGICAL REACTIONS AT THE INTERFACE OF SN/PB SOLDER AND ELECTROLESS COPPER-PLATED ALN SUBSTRATE
|
CHIOU, BS; CHANG, JH; DUH, JG |
| 國立交通大學 |
2014-12-08T15:03:03Z |
Temperature cycling effects between Sn/Pb solder and electroless copper plated AIN substrate
|
Chiou, BS; Chang, JH; Duh, JG |
顯示項目 31-43 / 43 (共2頁)
<< < 1 2
每頁顯示[10|25|50]項目
|
