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Showing items 6-15 of 43 (5 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:43:31Z |
Synthesis of Eu3+-activated yttrium oxysulfide red phosphor by flux fusion method
|
Lo, CL; Duh, JG; Chiou, BS; Peng, CC; Ozawa, L |
| 國立交通大學 |
2014-12-08T15:42:16Z |
Low-voltage cathodoluminescence properties of the Y2O2S : Eu red light emitting phosphor screen in field-emission environments
|
Lo, CL; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:41:51Z |
Microstructure characteristics for anorthite composite glass with nucleating agents of TiO2 under non-isothermal crystallization
|
Lo, CL; Duh, JG; Chiou, BS; Lee, WH |
| 國立交通大學 |
2014-12-08T15:41:20Z |
Effects of Ni thickness and reflow times on interfacial reactions between Ni/Cu under-bump metallization and eutectic Sn-Pb solder in flip-chip technology
|
Huang, CS; Duh, JG; Chen, YM; Wang, JH |
| 國立交通大學 |
2014-12-08T15:41:18Z |
Low temperature sintering and crystallisation behaviour of low loss anorthite-based glass-ceramics
|
Lo, CL; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:40:03Z |
Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip package
|
Huang, CS; Duh, JG; Chen, YM |
| 國立交通大學 |
2014-12-08T15:17:40Z |
Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder
|
Lin, YC; Duh, JG; Chiou, BS |
| 國立交通大學 |
2014-12-08T15:06:09Z |
DEHYDRATION OF SYNTHESIZED CALCIA-STABILIZED ZIRCONIA FROM A COPRECIPITATION PROCESS
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CHIOU, BS; HSU, WY; DUH, JG |
| 國立交通大學 |
2014-12-08T15:06:04Z |
MICROSTRUCTURE AND PROPERTIES OF MULTILAYER-DERIVED TUNGSTEN SILICIDE
|
CHIOU, BS; RAU, HL; CHANG, PH; DUH, JG |
| 國立交通大學 |
2014-12-08T15:06:02Z |
THE INFLUENCE OF FIRING PROFILE AND ADDITIVES ON THE PTCR EFFECT AND MICROSTRUCTURE OF BATIO3 CERAMICS
|
CHIOU, BS; KOH, CM; DUH, JG |
Showing items 6-15 of 43 (5 Page(s) Totally)
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