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Institution Date Title Author
臺大學術典藏 2022-09-21T23:30:32Z Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution Huang, J. H.; Shih, P. S.; Renganathan, V.; Grӓfner, S. J.; Chen, Y. A.; Huang, C. H.; Kao, C. L.; Lin, Y. S.; Hung, Y. C.; Kao, C. R.

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