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Institution Date Title Author
國立中山大學 2004 Wire-Bond Void Formation During High Temperature Aging Hen-So Chang;Ker-Chang Hsieh;Theo Martens;Albert Yang
國立中山大學 2003 The Effect of Pd and Cu in the Intermetallic Growth of Alloy Au Wire Hen-So Chang;Ker-Chang Hsieh;Theo Martens;Albert Yang
國立中山大學 2002 Interfacial Microstructure of Pb-Free and Pb-Sn Solder Balls in the Ball-Grid Array Package Chin-Su Chi;Hen-So Chang;Ker-Chang Hsieh;C.L. Chung
國立中山大學 2001 Intermetallic Growth of Wire-bond at 175 °C High Temperature Aging Hen-So Chang;J.X. Pon;Ker-Chang Hsieh;C.C. Chen

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