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Taiwan Academic Institutional Repository >
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"hung chi cheng"
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| 國立成功大學 |
2008-01 |
Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishing
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Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Suppression effect of low-concentration bis-(3-sodiumsulfopropyl disulfide) on copper electroplating
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Hung, Chi-Cheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Investigation of bis-(3-sodiumsulfopropyl disulfide) (SPS) decomposition in a copper-electroplating bath using mass spectroscopy
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Hung, Chi-Cheng; Lee, Wen-Hsi; Hu, Shao-Yu; Chang, Shih-Chieh; Chen, Kei-Wei; Wang, Ying-Lang |
| 國立成功大學 |
2008 |
Investigation of static corrosion between W metals and TiNx barriers in a W chemical-mechanical-polishing slurry
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Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh |
| 國立成功大學 |
2008 |
Competitive adsorption between bis(3-sodiumsulfopropyl disulfide) and polyalkylene glycols on copper electroplating
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Hung, Chi-Cheng; Wang, Ying-Lang; Lee, Wen-Hsi; Chang, Shih-Chieh |
| 國立成功大學 |
2008 |
Investigation of slurry chemical corrosion on TaN barriers with plasma treatment
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Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Ying-Lang |
| 國立成功大學 |
2007-05 |
Role of surface tension in copper electroplating
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Chang, Shih-Chieh; Wang, Ying-Lang; Hung, Chi-Cheng; Lee, Wen-His; Hwang, Gwo-Jen |
| 國立成功大學 |
2007 |
Investigation of galvanic corrosion between TaNx barriers and copper seed by electrochemical impedance spectroscopy
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Hung, Chi-Cheng; Lee, Wen-Hsi; Wang, Yu-Sheng; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立成功大學 |
2007 |
Galvanic corrosion between TaNx barriers and copper seed
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Hung, Chi-Cheng; Wang, Yu-Sheng; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang |
| 國立臺灣大學 |
2007 |
我國橋樑工程職業災害預防管理對策
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洪吉誠; Hung, Chi-Cheng |
Showing items 21-30 of 30 (2 Page(s) Totally)
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