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"hwang sheng jye"
Showing items 41-50 of 61 (7 Page(s) Totally)
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| 國立成功大學 |
2007-09 |
Simulations of process-induced warpage during IC encapsulation process
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Teng, Shiang-Yu; Hwang, Sheng-Jye |
| 國立成功大學 |
2007-04-12 |
Development of an external-type microinjection molding module for thermoplastic polymer
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Chang, Pei-Chi; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Dum-Yuan |
| 國立成功大學 |
2006-11-15 |
Experimental investigation of infrared rapid surface heating for injection molding
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Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006-10 |
Simulation of infrared rapid surface heating for injection molding
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Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006-09-25 |
The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold
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Chiu, S. M.; Hwang, Sheng-Jye; Chu, C. W.; Gan, Dershin |
| 國立成功大學 |
2006-03 |
P-V-T-C equation for epoxy molding compound
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Hwang, Sheng-Jye; Chang, Yi-San |
| 國立成功大學 |
2006-02 |
Injection molding of microprobe array parts
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Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006 |
vGeometry influence of reflectors for infrared rapid heating on micro-injection molding
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Chang, Pei-Chi; Hwang, Sheng-Jye |
| 國立成功大學 |
2006 |
Design and verification of a clamping system for micro-injection molding machine
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Chang, P. C.; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, D. Y. |
| 國立成功大學 |
2005-09-01 |
Isobaric cure shrinkage behaviors of epoxy molding compound in isothermal state
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Hwang, Sheng-Jye; Chang, Yi-San |
Showing items 41-50 of 61 (7 Page(s) Totally)
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