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Showing items 161-170 of 202 (21 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:35:19Z |
Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration
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Chien, Yu-San; Huang, Yan-Pin; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:16Z |
Low Temperature (< 180 degrees C) Bonding for 3D Integration
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Huang, Yan-Pin; Tzeng, Ruoh-Ning; Chien, Yu-San; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chuang, Ching-Te; Hwang, Wei; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:05Z |
A TSV-Based Bio-Signal Package With mu-Probe Array
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Chou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:33:26Z |
Novel Cu-to-Cu Bonding With Ti Passivation at 180 degrees C in 3-D Integration
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Huang, Yan-Pin; Chien, Yu-San; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chiu, Chi-Tsung; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:33:15Z |
Impacts of NBTI/PBTI on Timing Control Circuits and Degradation Tolerant Design in Nanoscale CMOS SRAM
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Yang, Hao-I.; Yang, Shyh-Chyi; Hwang, Wei; Chuang, Ching-Te |
| 國立交通大學 |
2014-12-08T15:31:09Z |
Impacts of NBTI/PBTI and Contact Resistance on Power-Gated SRAM With High-kappa Metal-Gate Devices
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Yang, Hao-I; Hwang, Wei; Chuang, Ching-Te |
| 國立交通大學 |
2014-12-08T15:31:08Z |
Adaptive Power Control Technique on Power-Gated Circuitries
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Hsieh, Wei-Chih; Hwang, Wei |
| 國立交通大學 |
2014-12-08T15:30:49Z |
Investigation of ICP Parameters for Smooth TSVs and Following Cu Plating Process in 3D Integration
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Chiang, Cheng-Hao; Hu, Yu-Chen; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:30:49Z |
Micro-masking Removal of TSV and Cavity during ICP Etching Using Parameter Control in 3D and MEMS Integrations
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Hu, Yu-Chen; Chiang, Cheng-Hao; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:30:06Z |
High-Performance 0.6V V-MIN 55nm 1.0Mb 6T SRAM with Adaptive BL Bleeder
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Yang, Hao-I; Lin, Yi-Wei; Hsia, Mao-Chih; Lin, Geng-Cing; Chang, Chi-Shin; Chen, Yin-Nien; Chuang, Ching-Te; Hwang, Wei; Jou, Shyh-Jye; Lien, Nan-Chun; Li, Hung-Yu; Lee, Kuen-Di; Shih, Wei-Chiang; Wu, Ya-Ping; Lee, Wen-Ta; Hsu, Chih-Chiang |
Showing items 161-170 of 202 (21 Page(s) Totally)
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