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机构 日期 题名 作者
國立成功大學 2004-06 Forging condition for removing porosities in the hybrid casting and forging process of 7075 aluminum alloy casting Chang, Fung-Chi; Hwang, Weng-Sing; Lee, Chung-Ham; Wu, Chun-Fu; Yang, Jin-Bin
國立成功大學 2004-06 Pasty ranges and latent heat release modes for Sn-9Zn-xAg lead-free solder alloys Tsai, Ying-Ling; Hwang, Weng-Sing
國立成功大學 2004-05 Study of micro-droplet behavior for a piezoelectric inkjet printing device using a single pulse voltage pattern Wu, Hsuan-Chung; Shan, Tzu-Ray; Hwang, Weng-Sing; Lin, Huey-Jiuan
國立成功大學 2004-03 Simulation of droplet ejection for a piezoelectric inkjet printing device Wu, Hsuan-Chung; Lin, Huey-Jiuan; Kuo, Yung-Chi; Hwang, Weng-Sing
國立成功大學 2004-01-30 Fluorine-modified low-k a-SiOC : H composite films prepared by plasma enhanced chemical vapor deposition JangJean, Shiuh-Ko; Liu, Chuan-Pu; Wang, Ying-Lang; Hwang, Weng-Sing; Tseng, Wei-Tsu; Chen, Sheng-Wen; Lo, Kuang-Yao
國立成功大學 2003-10 Mold filling analysis in lost foam casting process for aluminum alloys and its experimental validation Kuo, Jer-Haur; Chen, Jui-Ching; Pan, Yung-Ning; Hwang, Weng-Sing
國立成功大學 2003-10 Studies by mathematical and physical modelling of fluid flow and inclusion removal phenomena in slab tundish for casting stainless steel using various flow control device designs Fan, C. M.; Shie, R. J.; Hwang, Weng-Sing
國立成功大學 2003-08 Study of solid mushroom formation in direct iron ore smelting reduction process using low temperature water model Hwang, Y. P.; Fan, C. M.; Chen, Y. L.; Hwang, Weng-Sing; Chen, I. G.; Liu, S. H.
國立成功大學 2003-07 Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead-tin alloy solder joint in electronics packaging Chiu, Yu-Fang; Tsai, Ying-Ling; Hwang, Weng-Sing
國立成功大學 2003-06-30 In situ fluorine-modified organosilicate glass prepared by plasma enhanced chemical vapor deposition JangJean, Shiuh-Ko; Wang, Ying-Lang; Liu, Chuan-Pu; Hwang, Weng-Sing; Tseng, Wei-Tsu; Liu, Chi-Wen

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