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Institution Date Title Author
國立中山大學 2009 Electromigration in tin-copper, tin-silver, and eutectic tin-lead flip chip solder joints L. Xu;J. Liang;J.K. Han;Y.S. Lai;K.N. Tu
國立中山大學 2009 Effect of current density distribution on the formation of intermetallic compounds in Pb-free solder joints J.K. Han;L. Xu;S.W. Liang;K.N. Tu;Y.S. Lai

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