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"jain c c"
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| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish
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Jain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Low temperature direct electroless nickel plating on silicon wafer
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TUNG-HAN CHUANG; Yang, S.-R.; Chuang, T.-H.; Wang, S.-S.; Jain, C.-C. |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Intermetallic compounds formed in In-3Ag solder BGA packages with ENIG and ImAg surface finishes
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Chuang, T.H.; Jain, C.C.; Wang, S.S.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:10Z |
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads
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Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:09Z |
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
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Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:09Z |
The inhibition of tin whiskers on the surface of Sn-8Zn-3Bi-0.5Ce solders
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Chuang, T.H.; Lai, H.J.; Chen, C.L.; Jain, C.C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:09Z |
Morphology of the tin whiskers on the surface of a Sn-3Ag-0.5Cu-0.5Nd alloy
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Chuang, T.-H.; Jain, C.-C.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:04Z |
Low-Temperature Bonding of Bi0.5Sb1.5Te3 Thermoelectric Material with Cu Electrodes Using a Thin-Film In Interlayer
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Lin, Y.-C.; Yang, C.-L.; Huang, J.-Y.; Jain, C.-C.; Hwang, J.-D.; Chu, H.-S.; Chen, S.-C.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-01-06T03:11:16Z |
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads
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Jain, C. C.; Wang, S. S.; Huang, K. W.; Chuang, T. H.; STEVEN SHENG-SHIH WANG |
| 國立成功大學 |
2011-08 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
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Wu, R. W.; Tsao, L. C.; Chang, S. Y.; Jain, C. C.; Chen, R. S. |
| 國立臺灣大學 |
2011 |
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
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Chang, S.Y.; Jain, C.C.; Chuang, T.H.; Feng, L.P.; Tsao, L.C. |
| 國立臺灣大學 |
2011 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
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Wu, R.W.; Tsao, L.C.; Chang, S.Y.; Jain, C.C.; Chen, R.S. |
| 國立臺灣大學 |
2011 |
The Inhibition of Tin Whiskers on the Surface of Sn-8Zn-3Bi-0.5Ce Solders
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Jain, C.C.; Chen, C.L.; Lai, H.J.; Chuang, T.H. |
| 國立臺灣大學 |
2008 |
Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads
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Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H. |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
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Chuang, T.H.; Jain, C.C.; Wu, H.M. |
| 臺大學術典藏 |
2008 |
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
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ChuangTH; Wu, H.M.; Jain, C.C.; Chuang, T.H.; Chuang, T.H.; Jain, C.C.; Wu, H.M. |
| 國立臺灣大學 |
2007 |
Durability of Indium Tin Oxide-Silver-Indium Tin Oxide Films against Moisture Investigated Through the Wettability of the Top Oxide Layer
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Chen, S. W.; Bai, C. Y.; Jain, C. C.; Zhan, C. J.; Koo, C. H. |
| 國立臺灣大學 |
2007 |
The Microstructure and Mechanical Properties of AZ31-xRE Magnesium Alloys
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Jain, C. C.; Bai, C. Y.; Chen, S. W.; Koo, C. H. |
| 國立臺灣大學 |
2007 |
Creep and Corrosion properties of the Extruded Magnesium Alloy Containing Rare earth
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Jain, C. C.; Koo, C. H. |
| 國立臺灣大學 |
2006 |
Creep Behavior of Extruded Sheets of Magnesium Alloys Containing La-rich Mischmetal
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Jain, C. C.; Koo, C. H. |
Showing items 1-20 of 20 (1 Page(s) Totally)
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