| 臺大學術典藏 |
2021-08-05T02:41:49Z |
Device pattern impact on optical endpoint detection by interferometry for STI CMP
|
Bourzgui S;Roussy A;Blue J;Georges G;Faivre E;Labory K;Allard A.; Bourzgui S; Roussy A; Blue J; Georges G; Faivre E; Labory K; Allard A.; JAKEY BLUE |
| 臺大學術典藏 |
2021-08-05T02:41:49Z |
Equipment deterioration modeling and cause diagnosis in semiconductor manufacturing
|
Rostami H;Blue J;Chen A;Yugma C.; Rostami H; Blue J; Chen A; Yugma C.; JAKEY BLUE |
| 臺大學術典藏 |
2021-08-05T02:41:49Z |
Chamber Mismatching Calibration with Adjusted Run-to-Run Regulation in Semiconductor Manufacturing
|
Chouichi A;Blue J;Yugma C;Pasqualini F.; Chouichi A; Blue J; Yugma C; Pasqualini F.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-05T01:36:51Z |
Chamber-to-Chamber Discrepancy Detection in Semiconductor Manufacturing
|
Aabir Chouichi; JAKEY BLUE; Claude Yugma; Francois Pasqualini |
| 臺大學術典藏 |
2020-03-02T06:40:11Z |
Optimum sampling for track PEB CD integrated metrology
|
Chen, A.; Hsueh, S.; Blue, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:11Z |
Recipe-independent indicator for tool health diagnosis and predictive maintenance
|
Chen, A.; Blue, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:11Z |
Demand planning approaches to aggregating and forecasting interrelated demands for safety stock and backup capacity planning
|
Chen, A.; Hsu, C.-H.; Blue, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:11Z |
Recipe-independent tool health indicator and fault prognosis
|
Chen, A.; Blue, J.; Chou, T.-C.; Yang, T.-K.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:11Z |
Recipe-Independent Indicator for Tool Health Diagnosis and Predictive Maintenance
|
Chen, A.; Blue, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:10Z |
Integration of scheduling and advanced process control in semiconductor manufacturing: Review and outlook
|
Yugma, C.; Blue, J.; Dauzere-P?r?s, S.; Vialletelle, P.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:10Z |
Efficient FDC based on hierarchical tool condition monitoring scheme
|
Blue, J.; Roussy, A.; Thieullen, A.; Pinaton, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:10Z |
Spatial variance spectrum analysis and its application to unsupervised detection of systematic wafer spatial variations
|
Blue, J.; Chen, A.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:10Z |
Performance analysis of demand planning approaches for aggregating, forecasting and disaggregating interrelated demands
|
Chen, A.; Blue, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:09Z |
Run-To-Run sensor variation monitoring for process fault diagnosis in semiconductor manufacturing
|
Blue, J.; Roussy, A.; Pinaton, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:09Z |
Opportunity for improving fab effectiveness by predictive overall equipment effectiveness (POEE)
|
Kao, Y.-T.; Chang, S.-C.; Dauzere-Peres, S.; Blue, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:09Z |
Spatial risk assessment on circular domains: Application to wafer profile monitoring
|
Padonou, E.; Roustant, O.; Blue, J.; Duverneuil, H.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:09Z |
Integration of scheduling and advanced process control in semiconductor manufacturing: review and outlook
|
Yugma, C.; Blue, J.; Dauz?re-P?r?s, S.; Obeid, A.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:09Z |
FDC R2R variation monitoring for sensor level diagnosis in tool condition hierarchy
|
Blue, J.; Roussy, A.; Pinaton, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:08Z |
The light behavior from shallow trench isolation profiles at chemical mechanical planarization step and correlation with optical endpoint system by interferometry
|
Bourzgui, S.; Georges, G.; Roussy, A.; Blue, J.; Faivre, E.; Pinaton, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:08Z |
Key Effects and Process Parameters Extraction on the CD of Reactive Ion Etching (RIE) Based on DOE Modeling
|
Rizquez, M.; Roussy, A.; Blue, J.; Bucelle, L.; Pinaton, J.; Pasquet, J.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:08Z |
Generalized Overall Equipment Effectiveness for integrated scheduling and process control
|
Kao, Y.-T.; Chang, S.-C.; Blue, J.; Dauzere-Peres, S.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:08Z |
Translation-Invariant Multiscale Energy-Based PCA for Monitoring Batch Processes in Semiconductor Manufacturing
|
Rato, T.J.; Blue, J.; Pinaton, J.; Reis, M.S.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:07Z |
Automatic equipment fault fingerprint extraction for the fault diagnostic on the batch process data
|
Rostami, H.; Blue, J.; Yugma, C.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:07Z |
Heterogranular multivariate analytics for detecting and controlling the root causes of the mismatching machines in semiconductor manufacturing
|
Chouichi, A.; Blue, J.; Yugma, C.; Pasqualini, F.; JAKEY BLUE |
| 臺大學術典藏 |
2020-03-02T06:40:07Z |
Advanced run-to-run controller in semiconductor manufacturing with real-time equipment condition: APC: Advanced process control; AM: Advanced metrology
|
Yang, W.-T.; Blue, J.; Roussy, A.; Reis, M.; Pinaton, J.; JAKEY BLUE |
