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"kan t c"
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| 國立臺灣科技大學 |
2015 |
Post-layout Redundant Via Insertion Approach Considering Multiple Via Configuration
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Kan, T.-C.;Ruan, S.-J.;Chang, T.-F.;Yang, S.-H. |
| 國立臺灣科技大學 |
2014 |
Rule-based redundant via-aware standard cell design considering multiple via configuration
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Kan, T.-C.;Chen, Y.-J.;Hong, H.-M.;Ruan, S.-J. |
| 國立臺灣科技大學 |
2013 |
Configurable redundant via-aware standard cell design considering multi-via mechanism
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Kan, T.-C.;Hong, H.-M.;Chen, Y.-J.;Ruan, S.-J. |
| 國立臺灣科技大學 |
2013 |
Reliability consideration with rectangle- and double-signal through silicon vias insertion in 3D thermal-aware floorplanning
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Hsu, C.-H.;Ruan, S.-J.;Chen, Y.-J.;Kan, T.-C. |
| 國立臺灣科技大學 |
2013 |
Design of a practical nanometer-scale redundant via-aware standard cell library for improved redundant via1 insertion rate
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Kan, T.-C.;Yang, S.-H.;Chang, T.-F.;Ruan, S.-J. |
| 國立臺灣科技大學 |
2010 |
A novel crosstalk quantitative approach for simultaneously reducing power, noise, and delay based on bus-invert encoding schemes
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Ruan S.-J.; Kan T.-C.; Hsu J.-C. |
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