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Showing items 1-4 of 4 (1 Page(s) Totally)
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| 國立臺灣科技大學 |
2020 |
Open Defect Detection Not Utilizing Boundary Scan Flip-Flops in Assembled Circuit Boards
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Kanda, M.;Hashizume, M.;Ali, F.A.B.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2019 |
Stand-by mode test method of interconnects between dies in 3d ICs with IEEE 1149.1 test circuits
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Kanda, M.;Yabui, D.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2018 |
A defective level monitor of open defects in 3D ICs with a comparator of offset cancellation type
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Kanda, M.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
| 國立臺灣科技大學 |
2017 |
A built-in current sensor made of a comparator of offset cancellation type for electrical interconnect tests of 3D ICs
|
Kanda, M.;Hashizume, M.;Yotsuyanagi, H.;Lu, S.-K. |
Showing items 1-4 of 4 (1 Page(s) Totally)
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