|
English
|
正體中文
|
简体中文
|
0
|
|
???header.visitor??? :
52779201
???header.onlineuser??? :
595
???header.sponsordeclaration???
|
|
|
|
???tair.name??? >
???browser.page.title.author???
|
"kang s k"???jsp.browse.items-by-author.description???
Showing items 1-5 of 5 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 臺大學術典藏 |
2021-08-12T03:46:27Z |
Current needs and future directions of occupational safety and heath in a globalized world
|
Perera F.P.; Li T.Y.; CHINGCHUN LIN; Tang D.; Gilbert S.G.; Kang S.-K.; Aschner M. |
| 臺大學術典藏 |
2019-11-27T02:02:35Z |
Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium
|
C. ROBERT KAO;Kao C.R.;Kang S.K.;Chen W.M.; Chen W.M.; Kang S.K.; Kao C.R.; C. ROBERT KAO |
| 國立臺灣大學 |
2012 |
Effects of Ti addition to Sn–Ag and Sn–Cu solders
|
Chen, W.M.; Kang, S.K.; Kao, C.R. |
| 國立臺灣大學 |
2003-12 |
SPECIAL ISSUE ON LEAD-FREE SOLDERS AND PROCESSING ISSUES IN MICROELECTRONIC PACKAGING
|
Lucas, J. P.; Chada, S.; Kang, S. K.; Kao, C. R.; Lin, K. L.; Ready, J.; Yu, and J. |
| 國立臺灣大學 |
2001-09 |
Lead-free solder materials and soldering technologies
|
Kang, S. K.; Mavoori, H.; Chada, S.; Kao, C. R.; Smith, and R. W. |
Showing items 1-5 of 5 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
