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"kao and c r"的相關文件
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| 國立臺灣大學 |
2005-06 |
Electromigration-induced grain rotation in anisotropic conducting beta-tin
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Wu, A. T.; Gusak, A. M.; Tu, K. N.; Kao, and C. R. |
| 國立臺灣大學 |
2005-04 |
Solid-state reactions between Ni and tin-silver-copper solders with different Cu concentrations
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Luo, W. C.; Ho, C. E.; Tsai, J. Y.; Lin, Y. L.; Kao, and C. R. |
| 國立臺灣大學 |
2005-02 |
Controlling the microstructure from the gold-tin Reaction
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Tsai, J. Y.; Chang, C. W.; Shieh, Y. C.; Hu, Y. C.; Kao, and C. R. |
| 國立臺灣大學 |
2005-01 |
Electromigration induced failure in flip chip solder joints
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Lin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Kao, and C. R. |
| 國立臺灣大學 |
2004-12 |
Cross-interaction of UBM and soldering pad in flip-chip solder joints
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Tsai, C. M.; Luo, W. C.; Chang, C. W.; Shieh, Y. C.; Kao, and C. R. |
| 國立臺灣大學 |
2004-10 |
Effect of the gold thickness of the surface finish on the interfacial reactions in flip chip solder joints
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Lin, Y. L.; Luo, W. C.; Lin, Y. H.; Ho, C. E.; Kao, and C. R. |
| 國立臺灣大學 |
2004-09 |
The study of microstructure evolution of tin grains due to electromigration by using synchrotron X-ray microdiffraction
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Wu, A. T.; Tu, K. N.; Lloyd, J. R.; Tamura, N.; Valek, B. C.; Kao, and C. R. |
| 國立臺灣大學 |
2003-11 |
A Study on the Reaction between Cu and Sn-3.5Ag Solder Doped with Small Amounts of Ni
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Tsai, J. Y.; Hu, Y. C.; Tsai, C. M.; Kao, and C. R. |
| 國立臺灣大學 |
2003-07 |
Chemical reaction in advanced microelectronic packages
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Ho, C. E.; Lin, Y. L.; Tsai, J. Y.; Kao, and C. R. |
| 國立臺灣大學 |
2002-11 |
Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder joints
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Ho, C. E.; Shiau, L. C.; Kao, and C. R. |
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