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Institution	Date	Title	Author
國立臺灣大學	2005-06	Electromigration-induced grain rotation in anisotropic conducting beta-tin	Wu, A. T.; Gusak, A. M.; Tu, K. N.; Kao, and C. R.
國立臺灣大學	2005-04	Solid-state reactions between Ni and tin-silver-copper solders with different Cu concentrations	Luo, W. C.; Ho, C. E.; Tsai, J. Y.; Lin, Y. L.; Kao, and C. R.
國立臺灣大學	2005-02	Controlling the microstructure from the gold-tin Reaction	Tsai, J. Y.; Chang, C. W.; Shieh, Y. C.; Hu, Y. C.; Kao, and C. R.
國立臺灣大學	2005-01	Electromigration induced failure in flip chip solder joints	Lin, Y. H.; Tsai, C. M.; Hu, Y. C.; Lin, Y. L.; Kao, and C. R.
國立臺灣大學	2004-12	Cross-interaction of UBM and soldering pad in flip-chip solder joints	Tsai, C. M.; Luo, W. C.; Chang, C. W.; Shieh, Y. C.; Kao, and C. R.
國立臺灣大學	2004-10	Effect of the gold thickness of the surface finish on the interfacial reactions in flip chip solder joints	Lin, Y. L.; Luo, W. C.; Lin, Y. H.; Ho, C. E.; Kao, and C. R.
國立臺灣大學	2004-09	The study of microstructure evolution of tin grains due to electromigration by using synchrotron X-ray microdiffraction	Wu, A. T.; Tu, K. N.; Lloyd, J. R.; Tamura, N.; Valek, B. C.; Kao, and C. R.
國立臺灣大學	2003-11	A Study on the Reaction between Cu and Sn-3.5Ag Solder Doped with Small Amounts of Ni	Tsai, J. Y.; Hu, Y. C.; Tsai, C. M.; Kao, and C. R.
國立臺灣大學	2003-07	Chemical reaction in advanced microelectronic packages	Ho, C. E.; Lin, Y. L.; Tsai, J. Y.; Kao, and C. R.
國立臺灣大學	2002-11	Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder joints	Ho, C. E.; Shiau, L. C.; Kao, and C. R.
國立臺灣大學	2002-10	Effect of copper concentration on the solid-state reactions between tin-copper lead-free solders and nicke	Chen, W. T.; Tsai, R. Y.; Lin, Y. L.; Kao, and C. R.
國立臺灣大學	2002-06	Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni	Ho, C. E.; Tsai, R. Y.; Lin, Y. L.; Kao, and C. R.
國立臺灣大學	2002-05	Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni	Ho, C. E.; Lin, Y. L.; Kao, and C. R.
國立臺灣大學	2002-03	Reactions between SnAgCu lead-free solders and the Au/Ni surface finish in advanced electronic packages	Shiau, L. C.; Ho, C. E.; Kao, and C. R.
國立臺灣大學	2002-02	Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders	Chen, W. T.; Ho, C. E.; Kao, and C. R.
國立臺灣大學	2001-11	Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering	Ho, C. E.; Tsai, S. Y.; Kao, and C. R.
國立臺灣大學	2001-09	Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish	Liu, C. M.; Ho, C. E.; Chen, W. T.; Kao, and C. R.
國立臺灣大學	2001-04	Interactions between solder and metallization during long-term aging of advanced microelectronic packages	Ho, C. E.; Chen, W. T.; Kao, and C. R.
國立臺灣大學	2001-02	Selective interfacial reaction between Ni and Eutectic BiSn lead-free solder	Tao, W. H.; Chen, C.; Ho, C. E.; Chen, W. T.; Kao, and C. R.
國立臺灣大學	2000-10	Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish	Ho, C. E.; Zheng, R.; Luo, G. L.; Lin, A. H.; Kao, and C. R.
國立臺灣大學	2000-09	Optimizing the wire-bonding parameters for second bond in ball grid array packages	Ho, C. E.; Chen, C.; Kao, and C. R.
國立臺灣大學	2000-05	Using tert-butyl alcohol as an adductive agent for separation of an m-cresol and 2,6-xylenol mixture	Lee, L. S.; Lin, C. W.; Kao, and C. R.
國立臺灣大學	1999-11	Reaction kinetics of the solder-balls with pads in BGA packages during reflow soldering	Ho, C. E.; Chen, Y. M.; Kao, and C. R.
國立臺灣大學	1999-04	Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system	Jain, T. A.; Huang, C.G.; Ho, C. E.; Kao, and C. R.
國立臺灣大學	1999-02	Formation and absence of intermetallic compounds during solid-state reactions in the Ni-Bi system	Lee, M. S.; Chen, C.; Kao, and C. R.

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