| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Terminal Reaction Behaviors in Micro Bumps: Comparison of Ti and Cr Adhesion Layers
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Kao, Chen Wei; Kung, Po Yu; Chang, Chih Chia; Kao, C. R. |
| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface
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Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; Kao, C. R. |
| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating
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Chen, Y. A.; Shih, P. S.; Chang, F. L.; Grafner, S. J.; Huang, J. H.; Huang, C. H.; Kao, C. R.; Lin, Y. S.; Hung, Y. C.; Kao, C. L.; Tarng, D. |
| 臺大學術典藏 |
2022-09-21T23:30:33Z |
A novel method of low temperature, pressureless interconnection for wafer level scale 3D packaging
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Shih, P. S.; Shen, C. H.; Chen, Y. A.; Huang, C. H.; Grafner, S. J.; Huang, J. H.; Kao, C. R. |
| 臺大學術典藏 |
2022-09-21T23:30:32Z |
Solid-state bonding behavior between surface-nanostructured Cu and Au: a molecular dynamics simulation
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Tatsumi, Hiroaki; Kao, C. R.; Nishikawa, Hiroshi |
| 臺大學術典藏 |
2022-09-21T23:30:32Z |
Flow in a microchannel filled with arrays of numerous pillars
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Gräfner, S. J.; Wu, P. Y.; Kao, C. R. |
| 臺大學術典藏 |
2022-09-21T23:30:32Z |
Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution
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Huang, J. H.; Shih, P. S.; Renganathan, V.; Grӓfner, S. J.; Chen, Y. A.; Huang, C. H.; Kao, C. L.; Lin, Y. S.; Hung, Y. C.; Kao, C. R. |
| 臺大學術典藏 |
2022-04-21T23:17:26Z |
Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure
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Lee, Pei Tzu; Hsieh, Wan Zhen; Lee, Cheng Yu; Tseng, Shao Chin; Tang, Mau Tsu; Chiang, Ching Yu; Kao, C. R.; Ho, Cheng En |
| 臺大學術典藏 |
2022-04-21T23:17:25Z |
Hydrothermally constructed AgWO4-rGO nanocomposites as an electrode enhancer for ultrasensitive electrochemical detection of hazardous herbicide crisquat
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Maheshwaran, Selvarasu; Renganathan, Vengudusamy; Chen, Shen Ming; Balaji, Ramachandran; Kao, C. R.; Chandrasekar, Narendhar; Ethiraj, Selvarajan; Samuel, Melvin S.; Govarthanan, Muthusamy |
| 臺大學術典藏 |
2022-03-22T08:30:22Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
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Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:22Z |
Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications
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Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:22Z |
Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis
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Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:22Z |
A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn
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Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:21Z |
Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis
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Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:21Z |
White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5
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Lee P.-T;Hsieh W.-Z;Lee C.-Y;Kao C.R;Ho C.-E.; Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:21Z |
A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn
|
Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:21Z |
Numerical analysis of an electroless plating problem in gas–liquid two-phase flow
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Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:21Z |
Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications
|
Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:20Z |
Numerical analysis of an electroless plating problem in gas–liquid two-phase flow
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Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:20Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:20Z |
White X-ray nanodiffraction study of allotropic phase transformation of hexagonal- Into monoclinic-Cu6Sn5
|
Lee P.-T;Hsieh W.-Z;Lee C.-Y;Kao C.R;Ho C.-E.; Lee P.-T; Hsieh W.-Z; Lee C.-Y; Kao C.R; Ho C.-E.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:24Z |
Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis
|
Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:24Z |
A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn
|
Tsai C.-H;Lin S.-Y;Lee P.-T;Kao C.R.; Tsai C.-H; Lin S.-Y; Lee P.-T; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:23Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:23Z |
Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications
|
Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO |
