|
"kao c robert"的相关文件
显示项目 1-8 / 8 (共1页)
1
每页显示[10|25|50]项目
| 國立臺灣大學 |
2012 |
Critical Concerns in Soldering Reactions Arising from Space Confinement in 3-D IC Packages
|
Chuang, H.Y.; Yang, T.L.; Kuo, M.S.; Chen, Y.J.; Yu, J.J.; Li, C.C.; Kao, C.Robert |
| 國立臺灣大學 |
2011 |
Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints
|
Liu, Chao Sheng; Ho, Cheng En; Peng, Cheng Sam; Kao, C.Robert |
| 國立臺灣大學 |
2008 |
Lead-Free and Lead-Bearing Electronic Solders: Implementation, Reliability, and New Technology
|
Kao, C. Robert |
| 臺大學術典藏 |
2008 |
Lead-Free and Lead-Bearing Electronic Solders: Implementation, Reliability, and New Technology
|
Kao, C. Robert; Kao, C. Robert |
| 國立臺灣大學 |
2007 |
Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness
|
Chang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert |
| 臺大學術典藏 |
2007 |
Cross-Interaction between Ni and Cu across Sn Layers with Different Thickness
|
Chang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert; Chang, Chien Wei; Yang, Su Chun; Tu, Chun-Te; Kao, C. Robert |
| 國立成功大學 |
2006-12 |
Lead-free solder implementation: Reliability, alloy development, new technology - Foreword
|
Chawla, Nik; Chada, Srinivas; Kang, Sung K.; Kao, C. Robert; Lin, Kwang-Lung; Lucas, Jim; Turbini, Laura |
| 國立成功大學 |
2003-12 |
Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword
|
Lucas, James P.; Chada, Srini; Kang, Sung K.; Kao, C. Robert; Lin, Kwang-Lung; Ready, Jud; Yu, Jin |
显示项目 1-8 / 8 (共1页)
1
每页显示[10|25|50]项目
|
