臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
臺大學術典藏	2022-09-21T23:30:33Z	Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless Interconnection	YUNG-SHENG LIN; Hung, Yun Ching; Kao, Chin Li; Lai, Chung Hung; Shih, Po Shao; Huang, Jeng Hau; Tarng, David; C. ROBERT KAO
國立成功大學	2018-05-15	覆晶封裝電遷移可靠度之電熱耦合分析	高金利; Kao, Chin-Li
國立成功大學	2018-05-15	覆晶封裝電遷移可靠度之電熱耦合分析	高金利; Kao, Chin-Li
國立成功大學	2014-11	Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages	Kao, Chin-Li; Chen, Tei-Chen; Lai, Yi-Shao; Chiu, Ying-Ta

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