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| 國立交通大學 |
2018-08-21T05:56:58Z |
The brand-new high density "NCF=-type compliant-bumped COG" in high resolution LCD
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Chang, Shyh-Ming; Kao, Kuo-Shu; An, Chao-Chyun; Chen, Ming-Yao; Tsang, Jimmy; Yang, Sheng-Shu; Chen, Chih; Lin, Chung-Kuang; Chen, Wen-Chih |
| 國立交通大學 |
2017-04-21T06:49:42Z |
Fine pitch "NCF-type Compliant-bumped COG"
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An, Chao-Chyun; Chang, Shyh-Ming; Chen, Ming-Yao; Kao, Kuo-Shu; Tsang, Jimmy; Yang, Sheng-Shu; Chen, Chih; Lin, Chung-Kuang; Chen, Ren-Haw; Chen, Wen-Chih |
| 國立交通大學 |
2017-04-21T06:49:41Z |
Theoretical stress calculation and experimental results of "NCF-type compliant-bumped COG"
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Chen, Ming-Yao; An, Chao-Chyun; Chang, Shyh-Ming; Kao, Kuo-Shu; Tsang, Jimmy; Yang, Sheng-Shu; Chen, Chih; Lin, Chung-Kuang |
| 國立交通大學 |
2014-12-08T15:19:49Z |
Electrical characterization of fine-pitch compliant bumps
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Lin, C. K.; Chen, Chih; Chang, Shyh-Ming; An, Chao-Chyun; Lee, Hsiao Ting; Kao, Kuo-Shu; Tsang, Jimmy; Yang, Sheng-Shu |
| 國立交通大學 |
2014-12-08T15:01:52Z |
Electrical characterization of fine-pitch compliant bumps
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Lin, C. K.; Chen, Chih; Chang, Shyh-Ming; An, Chao-Chyun; Lee, Hsiao Ting; Kao, Kuo-Shu; Tsang, Jimmy; Yang, Sheng-Shu |
| 國立臺灣大學 |
2012 |
Reliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture
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Chang, Jing-Yao; Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Tao-Chih; Chuang, Tung-Han |
| 臺大學術典藏 |
2012 |
Reliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture
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Chang, Jing-Yao; Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Tao-Chih; Chuang, Tung-Han; Chang, Jing-Yao; Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Tao-Chih; Chuang, Tung-Han |
Showing items 1-7 of 7 (1 Page(s) Totally)
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