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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立交通大學 2018-08-21T05:54:31Z Effect of Sn grain orientation and strain distribution in 20-mu m-diameter microbumps on crack formation under thermal cycling tests Chu, Yi-Cheng; Chen, Chih; Kao, Nicholas; Jiang, Don Son
國立臺灣大學 2005-06 Mechanical behavior of flip chip packages under thermal loading Chen, Shoulung; Tsai, C.Z.; Kao, Nicholas; Wu, Enboa

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