臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立成功大學	2022-03-16	Self-assembly growth of electrolytic silver dendrites	Tsai;Wen-Chieh;Lin;Kwang-Lung
國立成功大學	2021-05	Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu	Lin;Ting-Chun;Liang;Chien-Lung;Wang;Shan-Bo;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Lin;Kwang-Lung
國立成功大學	2021-04	Electromigration-assisted manipulation of microstructure and properties of metals via cyclic direct current stressing treatment	Ku;Pu-Hsin;Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2020-12-1	Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density	Liang;Chien-Lung;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Wang;Shan-Bo;Hung;Yun-Ching;Lin;Gao-Tian;Lin;Kwang-Lung
國立成功大學	2020-11	Investigations of high-temperature tensile properties of Zn-25Sn-x(0.1-0.2)Cu-y(0.01-0.02)Ti high-temperature Pb-free solders	Lin;Jeng-Chi;Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2020-11	A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property	Liao;Yi-Han;Chen;Chang-Hsien;Liang;Chien-Lung;Lin;Kwang-Lung;Wu;Albert, T.
國立成功大學	2020-01-20	Electro-work hardening of metals induced by the athermal electromigration effect	Shu;Chih-Chi;Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2020-	Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-mu m L/S Cu Redistribution Lines	Liang;Chien-Lung;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Wang;Shan-Bo;Hung;Yun-Ching;Lin;Gao-Tian;Lin;Kwang-Lung
國立成功大學	2019-09-23	Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders	Lin;Jeng-Chi;Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2019-07	The microstructure and shear behavior of Zn-25Sn-xTi solder joints with Ni substrate	Chang;Che-Wei;Lin;Kwang-Lung

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