臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	Repositories
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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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	臺大學術典藏NTU Scholars

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Institution	Date	Title	Author
國立成功大學	2024-07~2024-08	The twin formation under electric current stressing and its effect on the properties of copper	Wu;Ming-Feng;Lin;Kwang-Lung
國立成功大學	2024-03	Microstructure and growth of Cu hillock on redistribution line under electromigration	Huang;Yen-Cheng;Tsai;Min-Yan;Lin;Ting-Chun;Lin;Yung-Sheng;Hung;Chi-Pin;Lin;Kwang-Lung
國立成功大學	2023-06	Electrorecrystallization of Invar 36 alloy	Huang;Jun-Jia;Lin;Kwang-Lung
國立成功大學	2023-03	Strengthening of Inconel 600 alloy with electric current stressing	Li;Wen-Jung;Lin;Kwang-Lung
國立成功大學	2022-04-15	Non-epitaxial silver nanodendrite growth via helical nano-yarn bundling at intra-dendrite interface under applied bias	Tsai;Wen-Chieh;Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2022-03-16	Self-assembly growth of electrolytic silver dendrites	Tsai;Wen-Chieh;Lin;Kwang-Lung
國立成功大學	2021-05	Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu	Lin;Ting-Chun;Liang;Chien-Lung;Wang;Shan-Bo;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Lin;Kwang-Lung
國立成功大學	2021-04	Electromigration-assisted manipulation of microstructure and properties of metals via cyclic direct current stressing treatment	Ku;Pu-Hsin;Liang;Chien-Lung;Lin;Kwang-Lung
國立成功大學	2020-12-1	Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density	Liang;Chien-Lung;Lin;Yung-Sheng;Kao;Chin-Li;Tarng;David;Wang;Shan-Bo;Hung;Yun-Ching;Lin;Gao-Tian;Lin;Kwang-Lung
國立成功大學	2020-11	Investigations of high-temperature tensile properties of Zn-25Sn-x(0.1-0.2)Cu-y(0.01-0.02)Ti high-temperature Pb-free solders	Lin;Jeng-Chi;Liang;Chien-Lung;Lin;Kwang-Lung

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