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Showing items 11-13 of 13 (1 Page(s) Totally) 1 View [10|25|50] records per page
| 國立成功大學 |
2009-01 |
Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints
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Lai, R. S.; Lin, Kwang-Lung; Salam, B. |
| 國立成功大學 |
2008 |
Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders
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Lai, R. S.; Lin, Kwang-Lung; Salam, B. |
| 臺大學術典藏 |
2001 |
Fullerenes as a new class of radioprotectors
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Lin, H.-S.;Lin, T.-S.;Lai, R.-S.;D'Rosario, T.;Luh, T.-Y.; Lin, H.-S.; Lin, T.-S.; Lai, R.-S.; D'Rosario, T.; Luh, T.-Y.; TIEN-YAU LUH |
Showing items 11-13 of 13 (1 Page(s) Totally) 1 View [10|25|50] records per page
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