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Institution Date Title Author
國立臺灣大學 2004-12 Cross-interaction of UBM and soldering pad in flip-chip solder joints Tsai, C. M.; Luo, W. C.; Chang, C. W.; Shieh, Y. C.; Kao, and C. R.
國立臺灣大學 2004-10 Effect of the gold thickness of the surface finish on the interfacial reactions in flip chip solder joints Lin, Y. L.; Luo, W. C.; Lin, Y. H.; Ho, C. E.; Kao, and C. R.
淡江大學 1989 Solvatochromism and conducting TCNQ salts of M-hydroxy-M(N-methyl) stilbazolium betaine isomers 余良杰; Yu, L. J.; Luo, W. C.

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