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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
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Institution Date Title Author
國立中山大學 2007 A Notch-Saddle-Compensation Technique in Butterfly-Type Laser Module Packages Y.C. Hsu;Y.C. Tsai;J.H. Kuang;M.T. Sheen;A.D. Lin;P.H. Hsu;W.H. Cheng
國立中山大學 2005 A Novel Fiber Alignment Shift Measurement and Correction Technique in Laser-Welded Laser Module Packaging Y.C. Hsu; Y.C. Tsai; Y.L. Ho; M.T. Sheen; J.H. Kuang; W.H. Cheng
國立中山大學 2005 The Joint Strength and Microstructure of Fluxless Au/Sn Solders in InP-Based Laser Diode Packages M.T. Sheen;Y.H. Ho;C.L. Wang;K.C. Hsieh;W.H. Cheng
國立中山大學 2004 An Optimum Approach for Reduction of Fiber Alignment of Fiber-Solder-Ferrule Joints in Laser Module Packaging W.H. Cheng;M.T. Sheen;C.M. Chang;Y.T. Tseng
國立中山大學 2004 Fiber Alignment Shifts in Butterfly Packaging by Laser Welding Technique: Measurement and Finite-Element-Method Analysis Y.C. Hsu;W.K. Huang;M.T. Sheen;W.H. Cheng
國立中山大學 2003 Effect of Temperature Cycling on Angular Alignment on Angular Alignment in Add/Drop Filter Module Packaging C.S. Hsieh; J.M. Chen; J.M. Hsu; M.T. Sheen; J.H. Kuang; W.H. Cheng
國立中山大學 2003 Effect of Temperature Cycling on Angular Alignment in Add/Drop Filter Module Packaging C.S. Hsieh;J.M. Chen;J.M. Hsu;M.T. Sheen;J.K. Kuang;W.H. Cheng
國立中山大學 2002 The Influence of Thermal Aging on Joint Strength and Fracture Surface of Pb/Sn and Au/Sn Solders in Laser Diode Packages M.T. Sheen; C.M. Chang; H.C. Teng; J.H. Kuang; K.C. Hsich; W.H. Cheng
國立中山大學 2002 The Influence of Thermal Aging on Joint Strength and Fracture Surface of Pb/Sn and Au/Sn Solders in Laser Diode Packages M.T. Sheen;C.M. Chang;H.C. Teng;J.H. Kung;K.C. Hsieh;W.H. Cheng;
國立中山大學 2002 sThe Influence of Thermal Aging on Joint Strength and Fracture Surface of PbSn and AuSn Solders in Laser Diode Packages M.T. Sheen;C.M. Chang;H.C. Teng;J.H. Kuang;K.C. Hsieh;W.H. Cheng

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