|
|
???tair.name??? >
???browser.page.title.author???
|
"m y"???jsp.browse.items-by-author.description???
Showing items 1-10 of 55 (6 Page(s) Totally)
1 2 3 4 5 6 > >>
View [10|25|50] records per page
| 國立成功大學 |
2024 |
Screening, Prediction and Remission of Depressive Disorder Using the Fuzzy Probability Function and Petri Net
|
Chiang;H, -S.;Chen;M, -Y. |
| 國立成功大學 |
2024 |
Action-time-controlled tabletop gamification improves physician‒nurse collaborative emergency room evacuation training
|
Wang;P, -H.;Chang;H, -C.;Hong;M, -Y.;Lin;I, -C.;Chen;S, -Y.;Chi;C, -H.;Chuang;C, -C.;Kao;C, -L.;Lin;C, -H. |
| 國立成功大學 |
2024 |
Hyperintensity in Bilateral Posterior Limbs of Internal Capsule Due to Hypernatremia
|
Wu;M, -Y.;Sun;Y, -T. |
| 國立成功大學 |
2024 |
An Infant-Type Hemispheric Glioma With SOX5::ALK: A Novel Fusion
|
Tsai;C, C.C.;Huang;M, -H.;Fang;C, -L.;Hsieh;K, L.-C.;Hsieh;T, -H.;Ho;W, -L.;Chang;H;Tsai;M, -L.;Kao;Y, -C.;Miser;J, S.;Wong;T, -T.;Su;M, -Y.;Liu;Y, -L. |
| 國立成功大學 |
2024 |
How to Enhance Consumer’s Engagement with Returnable Cup Services? A Study of a Strategic Approach to Achieve Environmental Sustainability
|
Yang;D, J.;Chiu;T, -P.;Ma;M, -Y. |
| 國立成功大學 |
2024 |
Study on the Influence of Runner and Overflow Area Design on Flow–Fiber Coupling in a Multi-Cavity System
|
Hsieh;F, -L.;Chen;C, -T.;Hwang;S, -S.;Hwang;S, -J.;Huang;P, -W.;Peng;H, -S.;Jien;M, -Y.;Huang;C, -T. |
| 國立成功大學 |
2024 |
LTPS TFT-Based Backlight Unit Using PWM Driving with Compensation for VTHVariation and Voltage Rise in Power Line
|
Lin;C, -L.;Chen;S, -C.;Lin;F, -Y.;Liao;W, -S.;Deng;M, -Y.;Peng;C, -T. |
| 國立成功大學 |
2024 |
Direct Observation of Void Nucleation and Growth in a 2-μm-Wide Cu Redistribution Line During In Situ Electromigration
|
Liang;C, -L.;Lin;Y, -S.;Tsai;M, -Y.;Chiu;M, -C.;Wang;S, -B.;Hung;C, -P.;Lin;K, -L. |
| 國立成功大學 |
2024 |
A Digital Twin Urban Flood Forecasting System Integrating a Weather Forecast Model and an Urban Flood Model
|
Chen;M, -Y.;Huang;C, -Y.;Liu;C, -Y.;Jang;J, -H.;Chang;T, -H.;Hsu;S, -C. |
| 國立成功大學 |
2024 |
Void Migration Kinetics in Fine Line Cu RDL under Electric Current Stressing and the Improvement of Electromigration Reliability by Polyimide Passivation
|
Huang;Y, -C.;Tsai;M, -Y.;Lin;T, -C.;Lin;Y, -S.;Wang;C, -C.;Hung;C, -P.;Lin;K, -L. |
Showing items 1-10 of 55 (6 Page(s) Totally)
1 2 3 4 5 6 > >>
View [10|25|50] records per page
|
