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"ou keng liang"???jsp.browse.items-by-author.description???
Showing items 161-166 of 166 (7 Page(s) Totally)
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| 臺北醫學大學 |
2004 |
High Cu Diffusion Resistance in Ultrathin Multi-quasi-amorphous CVD-Ti/TiNx Films
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Ou,Keng-Liang; Chiou,Shi-Yung; Lin,Ming-Hong |
| 臺北醫學大學 |
2004 |
Nanostructured TaN(O)/TaN barrier film formed by oxygen plasma treatment for copper interconnect
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Ou,Keng-Liang; Lin,Ming-Hong; Chiou,Shi-Yung |
| 臺北醫學大學 |
2003 |
Effects of nitrogen plasma treatment on tantalum diffusion barriers in copper metallization
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Wu,Wen-Fa; Ou,Keng-Liang; Chou,Chang-Pin; Wu,Chi-Chang |
| 臺北醫學大學 |
2003 |
PECVD-Ti/TiNx barrier with multilayered amorphous structure and high thermal stability for copper metallization
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Wu,Wen-Fa; Ou,Keng-Liang; Chou,Chang-Pin; Hsua,Jwo-Lun |
| 臺北醫學大學 |
2002 |
Improved TaN Barrier Layer Against Cu Diffusion by Formation of an Amorphous Layer Using Plasma Treatment
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Ou,Keng-Liang; Wu,Wen-Fa; Chou,Chang-Pin; Chiou,Shi-Yung; Wu,Chi-Chang |
| 臺北醫學大學 |
2001 |
Barrier Capability of TaNx Films Deposited by Different Nitrogen Flow Rate Against Cu Diffusion in Cu/TaNx/n+-p Junction Diodes
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Yang,Wen-Luh; Wu,Wen-Fa; Liu,Don-Gey; Wu,Chi-Chang; Ou,Keng Liang |
Showing items 161-166 of 166 (7 Page(s) Totally)
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