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Institution Date Title Author
臺大學術典藏 2022-09-21T23:30:32Z Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution Huang, J. H.; Shih, P. S.; Renganathan, V.; Grӓfner, S. J.; Chen, Y. A.; Huang, C. H.; Kao, C. L.; Lin, Y. S.; Hung, Y. C.; Kao, C. R.
臺大學術典藏 2022-03-22T08:30:22Z Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:22Z Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:22Z Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:22Z Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:21Z Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:21Z Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:21Z Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:21Z Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:24Z Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:24Z Bifunctional Nanocomposites Based on SiO2/NiS2 Combination for Electrochemical Sensing and Environmental Catalysis Renganathan V;Balaji R;Chen S.-M;Chandrasekar N;Maheshwaran S;Kao C.R.; Renganathan V; Balaji R; Chen S.-M; Chandrasekar N; Maheshwaran S; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:23Z Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:23Z Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications Zhu Z.X;Renganathan V;Kao C.R.; Zhu Z.X; Renganathan V; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2021-08-05T02:40:46Z Copper sulfide nano-globules reinforced electrodes for high-performance electrochemical determination of toxic pollutant hydroquinone Maheshwaran S;Balaji R;Chen S.-M;Biswadeep R;Renganathan V;Narendhar C;Kao C.R.; Maheshwaran S; Balaji R; Chen S.-M; Biswadeep R; Renganathan V; Narendhar C; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2021-08-05T02:40:46Z Copper sulfide nano-globules reinforced electrodes for high-performance electrochemical determination of toxic pollutant hydroquinone Maheshwaran S;Balaji R;Chen S.-M;Biswadeep R;Renganathan V;Narendhar C;Kao C.R.; Maheshwaran S; Balaji R; Chen S.-M; Biswadeep R; Renganathan V; Narendhar C; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2021-08-05T02:40:45Z Highly uniform microfluidic electroless interconnections for chip stacking applications Hung H.T;Ma Z.D;Shih P.S;Huang J.H;Kao L.Y;Yang C.Y;Renganathan V;Kao C.L;Hung Y.C;Kao C.R.; Hung H.T; Ma Z.D; Shih P.S; Huang J.H; Kao L.Y; Yang C.Y; Renganathan V; Kao C.L; Hung Y.C; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2021-08-05T02:40:45Z Highly uniform microfluidic electroless interconnections for chip stacking applications Hung H.T;Ma Z.D;Shih P.S;Huang J.H;Kao L.Y;Yang C.Y;Renganathan V;Kao C.L;Hung Y.C;Kao C.R.; Hung H.T; Ma Z.D; Shih P.S; Huang J.H; Kao L.Y; Yang C.Y; Renganathan V; Kao C.L; Hung Y.C; Kao C.R.; C. ROBERT KAO

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