臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Showing items 11-20 of 23 (3 Page(s) Totally)
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Institution	Date	Title	Author
國立中山大學	2009	Influence of power cycling durations on thermal and fatigue reliability characteristics of board-level chip-scale packages	T.H. Wang;C.C. Lee;Y.S. Lai;K.Y. Lee
國立中山大學	2009	Coupled power and thermal cycling reliability of board-level package-on-package stacking assembly	T.H. Wang;Y.S. Lai;C.C. Lee;Y.C. Lin
國立中山大學	2009	Numerical examinations of thermal cycling fatiguereliability of substrate through holes	T.H. Chen;T.H. Wang;Y.S. Lai
國立中山大學	2009	Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber	T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai
國立中山大學	2009	Numerical examinations of thermal cycling fatiguereliability of substrate through holes	T.H. Chen;T.H. Wang;Y.S. Lai
國立中山大學	2009	Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber	T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai
國立中山大學	2009	Effect of surface roughness of silicon dies and copper heat spreaders to the thermal performance of HFCBGAs	T.H. Wang;S.N. Paisner;C.C. Lee;S. Chen;Y.S. Lai
國立中山大學	2009	High-power-used thermal gel degradation evaluation on board-level HFCBGA subjected to reliability tests	T.H. Wang;H.Y. Chen;C.C. Lee;Y.S. Lai
淡江大學	2008-03	Intelligent control of dynamic target tracking of a car-like wheeled robot in a sensor-network environment	翁慶昌 ; Wong, Ching-chang ; C.L. Hwang;T.H. Wang
國立高雄應用科技大學	2007	Analysis of the substrate effects of strain-hardening thin films on silicon under nanoindentation	T.H.Wang; T.H.Fang; Y.C.Lin

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