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機構 日期 題名 作者
臺大學術典藏 2018-09-10T09:50:39Z Analytical Design of Via Lattice for Ground Planes Noise Suppression and Application on Embedded Planar EBG Structures C.-H. Huang;T.-L. Wu; C.-H. Huang; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:25:12Z Eye prediction of digital driver with power distribution network noise C.-C. Chou;H.-H. Chuang;S.-H. Weng;C.-K. Cheng;T.-L. Wu; C.-C. Chou; H.-H. Chuang; S.-H. Weng; C.-K. Cheng; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:25:12Z A novel compact 3-dB forward-wave directional coupler with periodic capacitive enhancement T.-H. Lin, J.-C. Yen, S.-K. Hsu;T.-L. Wu; T.-H. Lin, J.-C. Yen, S.-K. Hsu; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:25:11Z A compact and embedded balanced bandpass filter with wideband common-mode suppression on wireless SiP H.-C. Chen;C.-H. Tsai;T.-L. Wu; H.-C. Chen; C.-H. Tsai; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:25:11Z Radiation suppression for cable-attached packages utilizing a compact embedded common-mode filter C.-Y. Hsiao;C.-H. Tsai;C.-N. Chiu;T.-L. Wu; C.-Y. Hsiao; C.-H. Tsai; C.-N. Chiu; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:25:11Z A new solution and its estimation method for slot-crossing signals to reduce ISI-increased crosstalk Y.-J. Chang;C.-C. Chou;H.-H. Chuang;T.-L. Wu; Y.-J. Chang; C.-C. Chou; H.-H. Chuang; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:25:11Z A Novel Dual-Functional Structure Integrating Differential-Mode Equalizer with Common-Mode Filter for Gbps Signaling Y.-J. Cheng;H.-H. Chuang;T.-L. Wu; Y.-J. Cheng; H.-H. Chuang; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:25:11Z A novel miniaturized bandstop filter using defected ground on system in package (SiP) T.-W. Weng;T. -L. Wu; T.-W. Weng; T. -L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:25:10Z Bandwidth enhancement based on optimized via location for multiple vias EBG power/ground planes C.-D. Wang;Y.-M. Yu;F. d. Paulis;A. C. Scogna;A. Orl;i;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-M. Yu; F. d. Paulis; A. C. Scogna; A. Orl; i; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU; YIH-PENG CHIOU
臺大學術典藏 2018-09-10T09:25:10Z A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method YIH-PENG CHIOU; T.-Y. Cheng;C.-D. Wang;Y.-P. Chiou;T.-L. Wu; T.-Y. Cheng; C.-D. Wang; Y.-P. Chiou; T.-L. Wu; TZONG-LIN WU

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