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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立臺灣大學 2006-04 Capacities of soil to buffer acid rain in an alpine forest toposequence of central Taiwan Zhuang, S.Y.; M.K. Wang, H.B. King, J.L. Hwong, K.C.Lin, C.H. Lai, F.S. Hsu; T.Y. Tseng
國立中山大學 2006 A Novel Fabrication of Germanium Nanocrystal Embedded in Silicon-Oxygen-Nitride Layer C.H. Tu;T.C. Chang;P.T. Liu;H.C. Liu;C.F. Weng;J.H. Shy;B.H. Tseng;T.Y. Tseng;S.M. Sze;C.Y. Chang
國立中山大學 2005 Effects of oxygen plasma ashing on barrier dielectric SiCN film C.W. Chen;T.C. Chang;P.T. Liu;T.S. Tsai;T.Y. Tseng
國立中山大學 2005 High performance hydrogenated amorphous Si TFT for AMLCD and AMOLED C.W. Chen;T.C. Chang;P.T. Liu;T.Y. Tseng
國立中山大學 2005 Electrical degradation of n-channel poly-si TFT under AC stress C.W. Chen;T.C. Chang;P.T. Liu;H.Y. Lu;C.F. Weng;C.W. Hu;T.Y. Tseng
國立中山大學 2004 Method to improve chemical-mechanical-planarization polishing rate of low-k methyl-silsesquiazane for ultralarge scale integrated interconnect application T.C. Chang;T.M. Tsai;P.T. Liu;S.T. Yan;Y.C. Chang;H. Aoki;S.M. Sze;T.Y. Tseng
國立中山大學 2004 Study on the effect of electron beam curing on low-K porous organosilicate glass (OSG) material T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;T.Y. Tseng
國立中山大學 2004 CMP of Ultra Low-k Material Porous-Polysilazane (PPSZ) for Interconnect Applications T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;Y.C. Chang;T.Y. Tseng
國立中山大學 2004 CMP of low-k methylsilsesquiazane with oxygen plasma treatment for multilevel interconnect applications T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;Y.C. Chang;T.Y. Tseng
國立中山大學 2004 CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;T.Y. Tseng

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