English  |  正體中文  |  简体中文  |  0  
???header.visitor??? :  52843342    ???header.onlineuser??? :  667
???header.sponsordeclaration???
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
???ui.leftmenu.abouttair???

???ui.leftmenu.bartitle???

???index.news???

???ui.leftmenu.copyrighttitle???

???ui.leftmenu.link???

"tu k n"???jsp.browse.items-by-author.description???

???jsp.browse.items-by-author.back???
???jsp.browse.items-by-author.order1??? ???jsp.browse.items-by-author.order2???

Showing items 6-15 of 65  (7 Page(s) Totally)
1 2 3 4 5 6 7 > >>
View [10|25|50] records per page

Institution Date Title Author
臺大學術典藏 2022-06-30T02:06:20Z Heterogeneous and homogeneous nucleation of epitaxial NiSi2 in [110] Si nanowires Chou Y.-C.; Wu W.-W.; Lee C.-Y.; Liu C.-Y.; Chen L.-J.; Tu K.-N.; YI-CHIA CHOU
臺大學術典藏 2022-06-30T02:06:20Z Nucleation and growth of epitaxial silicide in silicon nanowires Chou Y.-C.; Lu K.-C.; Tu K.N.; YI-CHIA CHOU
臺大學術典藏 2022-06-30T02:06:18Z Formation of epitaxial silicide in silicon nanowires Chou Y.-C.; Lu K.-C.; Tu K.-N.; YI-CHIA CHOU
臺大學術典藏 2022-06-30T02:06:18Z Core-Shell Effect on Nucleation and Growth of Epitaxial Silicide in Nanowire of Silicon Chou Y.-C.; Tu K.-N.; YI-CHIA CHOU
臺大學術典藏 2022-06-30T02:06:16Z Effect of Elastic Strain Fluctuation on Atomic Layer Growth of Epitaxial Silicide in Si Nanowires by Point Contact Reactions Chou Y.-C.; Tang W.; Chiou C.-J.; Chen K.; Minor A.M.; Tu K.N.; Chou Y.-C.; Tang W.; Chiou C.-J.; Chen K.; Minor A.M.; Tu K.N.; YI-CHIA CHOU
臺大學術典藏 2022-06-30T02:06:08Z Fabrication and characteristics of highly ⟨ 110 ⟩ -oriented nanotwinned Au films Chiu W.-L.; Liu C.-M.; Lin H.-W.; Wu J.A.; Chou Y.-C.; Tu K.N.; Chen C.; Chiu W.-L.; Liu C.-M.; Lin H.-W.; Wu J.A.; Chou Y.-C.; Tu K.N.; Chen C.; YI-CHIA CHOU
臺大學術典藏 2020-05-12T02:53:12Z Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads TUNG-HAN CHUANG; Tu, K.N.; Chuang, T.H.; Lin, S.Z.; Wu, A.T.; Lin, W.H.
國立交通大學 2020-05-05T00:01:29Z Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder joints Chen, Chih; Tu, K. N.; Gusak, A. M.
國立交通大學 2020-02-02T23:55:32Z Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copper Juang, Jing Ye; Shie, Kai Cheng; Hsu, Po-Ning; Li, Yu Jin; Tu, K. N.; Chen, Chin
國立交通大學 2020-01-02T00:04:23Z Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure Wang, I-Ju; Ku, Ching-Shun; Tu-Ngoc Lam; Huang, E-Wen; Tu, K. N.; Chen, Chih

Showing items 6-15 of 65  (7 Page(s) Totally)
1 2 3 4 5 6 7 > >>
View [10|25|50] records per page