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"tu king ning"的相关文件
显示项目 11-20 / 32 (共4页)
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| 國立交通大學 |
2017-04-21T06:55:33Z |
Optimization of the nanotwin-induced zigzag surface of copper by electromigration
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Chen, Hsin-Ping; Huang, Chun-Wei; Wang, Chun-Wen; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, King-Ning |
| 國立交通大學 |
2017-04-21T06:55:10Z |
Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling
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Chang, Yuan-Wei; Cheng, Yin; Xu, Feng; Helfen, Lukas; Tian, Tian; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging
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Chiu, Wei-Lan; Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2015-07-21T11:20:25Z |
Extremely anisotropic single-crystal growth in nanotwinned copper
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Lu, Chia-Ling; Lin, Han-Wen; Liu, Chien-Min; Huang, Yi-Sa; Lu, Tien-Lin; Liu, Tao-Chi; Hsiao, Hsiang-Yao; Chen, Chih; Kuo, Jui-Chao; Tu, King-Ning |
| 國立交通大學 |
2015-07-21T08:28:39Z |
Materials challenges in three-dimensional integrated circuits
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Chen, Kuan-Neng; Tu, King-Ning |
| 國立交通大學 |
2015-05-12T02:59:51Z |
SINGLE CRYSTAL COPPER, MANUFACTURING METHOD THEREOF AND SUBSTRATE COMPRISING THE SAME
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CHEN Chih; TU King-Ning; LU Chia-Ling |
| 國立交通大學 |
2014-12-16T06:16:14Z |
Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints
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Chen, Chih; Yeh, Everett Chang-Ching; Tu, King-Ning |
| 國立交通大學 |
2014-12-16T06:15:02Z |
SPECIMEN BOX FOR ELECTRON MICROSCOPE
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CHEN Chih; TU King-Ning |
| 國立交通大學 |
2014-12-16T06:15:02Z |
SPECIMEN BOX FOR ELECTRON MICROSCOPE
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CHEN Chih; Tu King-Ning |
| 國立交通大學 |
2014-12-16T06:15:01Z |
METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDS
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CHEN Chih; TU King-Ning; HSIAO Hsiang-Yao |
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