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Institution Date Title Author
國立交通大學 2017-04-21T06:49:12Z Ultrathin Glass Wafer Lamination and Laser Debonding to Enable Glass Interposer Fabrication Shen, Wen-Wei; Chang, Hsiang-Hung; Wang, Jen-Chun; Ko, Cheng-Ta; Tsai, Leon; Wang, Bor Kai; Shorey, Aric; Lee, Alvin; Su, Jay; Bai, Dongshun; Huang, Baron; Lo, Wei-Chung; Chen, Kuan-Neng
國立臺灣大學 2005 具CaCu5結構之三元稀土銅鋁合金的電磁性質研究 王柏凱; Wang, Bor-Kai
國立成功大學 2004-06-01 Temperature dependence of the resonant tunneling fields in high-spin molecules Tsai, Hui-Lien; Chang, Ching-Ray; Cheng, Tai-Chung; Jwo, Tyn-Yih; Wang, Bor-Kai

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