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"wu wen fa"的相關文件
顯示項目 31-40 / 68 (共7頁)
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| 國立交通大學 |
2014-12-08T15:22:44Z |
Induced NH2 bonding of carbon nanotubes using NH3 plasma-enhanced chemical vapor deposition
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Chiou, Ai-Huei; Chang, Yu-Ming; Wu, Wen-Fa; Chou, Chang-Ping; Hsu, Chun-Yao |
| 國立交通大學 |
2014-12-08T15:21:38Z |
Evaluating nanotribological behavior of annealing Si(0.8)Ge(0.2)/Si films
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Wu, Ming-Jhang; Wen, Hua-Chiang; Wu, Shyh-Chi; Yang, Ping-Feng; Lai, Yi-Shao; Hsu, Wen-Kuang; Wu, Wen-Fa; Chou, Chang-Pin |
| 國立交通大學 |
2014-12-08T15:16:29Z |
Repairing of etching-induced damage of high-k Ba0.5Sr0.5TiO3 thin films by oxygen surface plasma treatment
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Tsai, Kou-Chiang; Wu, Wen-Fa; Chao, Chuen-Guang; Lee, Jain-Tsai; Hsu, Jwo-Lun |
| 國立交通大學 |
2014-12-08T15:16:29Z |
Improving electrical properties and thermal stability of (Ba,Sr)TiO3 thin films on Cu(Mg) bottom electrodes
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Tsai, Kou-Chiang; Wu, Wen-Fa; Chao, Chuen-Guang; Lee, Jain-Tsai; Shen, Shih-Wen |
| 國立交通大學 |
2014-12-08T15:16:19Z |
Influence of bias-temperature stressing on the electrical characteristics of SiOC : H film with Cu/TaN/Ta-gated capacitor
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Tsai, Kou-Chiang; Wu, Wen-Fa; Chao, Chuen-Guang |
| 國立交通大學 |
2014-12-08T15:15:05Z |
Improving electrical characteristics of Ta/Ta2O5/Ta capacitors using low-temperature inductively coupled N2O plasma annealing
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Tsai, Kou-Chiang; Wu, Wen-Fa; Chao, Chuen-Guang; Wu, Chi-Chang |
| 國立交通大學 |
2014-12-08T15:14:53Z |
Mesoporous silica reinforced by silica nanoparticles to enhance mechanical performance
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Luo, Jen-Tsung; Wen, Hua-Chiang; Chang, Yu-Ming; Wu, Wen-Fa; Chou, Chang-Pin |
| 國立交通大學 |
2014-12-08T15:14:22Z |
Reinforcing porous silica with carbon nanotubes to enhance mechanical performance
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Luo, Jen-Tsung; Wen, Hua-Chiang; Chou, Chang-Pin; Wu, Wen-Fa; Wan, Ben-Zu |
| 國立交通大學 |
2014-12-08T15:13:49Z |
The roles of hydrophobic group on the surface of ultra low dielectric constant porous silica film during thermal treatment
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Luo, Jen-Tsung; Wu, Wen-Fa; Wen, Hua-Chiang; Wan, Ben-Zu; Chang, Yu-Ming; Chou, Chang-Pin; Chen, Jun-Ming; Chen, Wu-Nan |
| 國立交通大學 |
2014-12-08T15:13:40Z |
Influences of Ti, TiN, Ta and TaN layers on integration of low-k SiOC : H and Cu
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Tsai, Kou-Chiang; Wu, Wen-Fa; Chao, Chuen-Guang; Hsu, Jwo-Lun; Chiang, Chiu-Fen |
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