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Showing items 11-20 of 38 (4 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:42:00Z |
Improved TaN barrier layer against Cu diffusion by formation of an amorphous layer using plasma treatment
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Ou, KL; Wu, WF; Chou, CP; Chiou, SY; Wu, CC |
| 國立交通大學 |
2014-12-08T15:41:47Z |
Improving the electrical integrity of Cu-CoSi2 contacted n(+)p junction diodes using nitrogen-incorporated Ta films as a diffusion barrier
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Yang, WL; Wu, WF; You, HC; Ou, KL; Lei, TF; Chou, CP |
| 國立交通大學 |
2014-12-08T15:41:21Z |
Effects of nitrogen plasma treatment on tantalum diffusion barriers in copper metallization
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Wu, WF; Ou, KL; Chou, CP; Wu, CC |
| 國立交通大學 |
2014-12-08T15:41:19Z |
PECVD-Ti/TiNx barrier with multilayered amorphous structure and high thermal stability for copper metallization
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Wu, WF; Ou, KL; Chou, CP; Hsu, JL |
| 國立交通大學 |
2014-12-08T15:39:18Z |
Influence of N2O plasma treatment on microstructure and thermal stability of WNx barriers for Cu interconnection
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Tsai, KC; Wu, WF; Chen, JC; Pan, TJ; Chao, CG |
| 國立交通大學 |
2014-12-08T15:38:51Z |
Electromigration and integration aspects for the copper-SiLK system
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Tseng, HS; Chiou, BS; Wu, WF; Ho, CC |
| 國立交通大學 |
2014-12-08T15:37:09Z |
Numerical and experimental analysis of Cu diffusion in plasma-treated tungsten barrier
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Tsai, KC; Wu, WF; Chen, JC; Pan, TJ; Chao, CG |
| 國立交通大學 |
2014-12-08T15:27:50Z |
FABRICATION AND CHARACTERISTICS OF RF MAGNETRON-SPUTTERED ITO THIN-FILMS
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WU, WF; CHIOU, BS |
| 國立交通大學 |
2014-12-08T15:27:02Z |
Plasma process induced damage in sputtered TiN metal gate capacitors with ultra-thin nitrided oxide
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Chen, CC; Lin, HC; Chang, CY; Chao, TS; Huang, SC; Wu, WF; Huang, TY; Liang, MS |
| 國立交通大學 |
2014-12-08T15:18:43Z |
Novel multilayered Ti/TiN diffusion barrier for Al metallization
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Wu, WF; Tsai, KC; Chao, CG; Chen, JC; Ou, KL |
Showing items 11-20 of 38 (4 Page(s) Totally)
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