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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立成功大學 2024 Synthesis and characterization of a dithiodiglycolic acid-incorporated poly(glycerol sebacate) exhibiting lipase resistance and antibacterial properties Jiang;Y, -S.;Hu;M, -H.;Hu;J, -J.;Jan;J, -S.
國立成功大學 2024 Enhanced Electrochemical Performance of Ca-Doped Na3V2(PO4)2F3/C Cathode Materials for Sodium-Ion Batteries Puspitasari;D, A.;Patra;J;Hernandha;R, F.H.;Chiang;Y, -S.;Inoishi;A;Chang;B, K.;Lee;T, -C.;Chang;J, -K.
國立成功大學 2024 Universal Transfer Framework for Urban Spatiotemporal Knowledge Based on Radial Basis Function Chiu;S, -M.;Liou;Y, -S.;Chen;Y, -C.;Lee;C;Shang;R, -K.;Chang;T, -Y.;Zimmermann;R
國立成功大學 2024 Direct Observation of Void Nucleation and Growth in a 2-μm-Wide Cu Redistribution Line During In Situ Electromigration Liang;C, -L.;Lin;Y, -S.;Tsai;M, -Y.;Chiu;M, -C.;Wang;S, -B.;Hung;C, -P.;Lin;K, -L.
國立成功大學 2024 Implementation of a Navigation System Based on the Integration of Inertial Navigation System/Positioning System Chang;L, -C.;Wang;Y, -S.;Ho;M, -T.
國立成功大學 2024 Terahertz plasmonic hollow-core waveguide based on a metal-wire-woven hole array You;B;Yu;L, -C.;Tsai;H, -Y.;Lin;Y, -S.;Lu;J, -Y.
國立成功大學 2024 Void Migration Kinetics in Fine Line Cu RDL under Electric Current Stressing and the Improvement of Electromigration Reliability by Polyimide Passivation Huang;Y, -C.;Tsai;M, -Y.;Lin;T, -C.;Lin;Y, -S.;Wang;C, -C.;Hung;C, -P.;Lin;K, -L.
國立成功大學 2024 Effect of Microstructure on the Electromigration Performance of 2- μm-Cu Redistribution Line under In-situ SEM Observation Tsai;M, -Y.;Lin;T, -C.;Huang;Y, -C.;Wang;S, -B.;Lin;Y, -S.;Lin;K, -L.
國立成功大學 2024 A Parallel and Distributed Quantum SAT Solver Based on Entanglement and Teleportation Lin;S, -W.;Wang;T, -F.;Chen;Y, -R.;Hou;Z;Sanan;D;Teo;Y, S.
國立成功大學 2024 A Force-Controlled Gripper Capable of Measuring Mechanical Properties of an Object Tsai;Y, -S.;Yeh;P, -C.;Huang;C, -H.;Hsueh;I, -C.;Lan;C, -C.

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