臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

	English \| 正體中文 \| 简体中文 \| 0
	???header.visitor??? : 52928340 ???header.onlineuser??? : 822 ???header.sponsordeclaration???

???search.scope???

???search.advance???

???search.login???

???search.administrator???

臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

???ui.leftmenu.abouttair???
	???ui.leftmenu.explanation???

???ui.leftmenu.bartitle???
	Repositories
	Author
	Title
	Date
	???ui.leftmenu.statisticschart???
	???ui.leftmenu.realtimefacts???
	???ui.leftmenu.trend???

???index.news???
	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

???ui.leftmenu.copyrighttitle???
	???ui.leftmenu.copyrightpublisher???
	???ui.leftmenu.copyrightconference???

???ui.leftmenu.link???
	機構典藏計畫網站
	ROAR
	OpenDOAR
	SHERPA
	OAIster
	JAIRO
	Ira
	DSPACE
	RWWR
	臺大學術典藏NTU Scholars

"y s lai"???jsp.browse.items-by-author.description???

???jsp.browse.items-by-author.back???
???jsp.browse.items-by-author.order1???	???jsp.browse.items-by-author.order2???

Showing items 11-20 of 87 (9 Page(s) Totally)
<< < 1 2 3 4 5 6 7 8 9 > >>
View [10|25|50] records per page

Institution	Date	Title	Author
國立中山大學	2009	Nonuniform and negative marker displacements induced by current crowding during electromigration in flip-chip Sn-0.7 Cu solder joints	S.W. Liang;H.Y. Hsiao;C. Chen;L. Xu;K.N. Tu;Y.S. Lai
國立中山大學	2009	First-principles calculations of elastic properties of Cu3Sn and Cu6Sn5 intermetallics	J. Chen;Y.S. Lai;P.F. Yang
國立中山大學	2009	In situ measurements of thermal and electrical effects of strain in flip-chip silicon dies using synchrotron radiation x-rays	A.T. Wu;C.Y. Tsai;C.L. Kao;M.K. Shih;Y.S. Lai;H.Y. Lee;C.S. Ku
國立中山大學	2009	Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates	C.C. Chang;Y.W. Lin;Y.S. Lai;C.R. Kao
國立中山大學	2009	Thermomigration versus electromigration in microelectronics solder joints	M.F. Abdulhamid;C. Basaran;Y.S. Lai
國立中山大學	2009	Design optimization of needle geometry for wafer-level probing test	M.K. Shih;Y.S. Lai
國立中山大學	2009	In situ measurement of electromigration-induced transient stress in Pb-free Sn-Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffraction	K. Chen;N. Tamura;M. Kunz;K.N. Tu;Y.S. Lai
國立中山大學	2009	Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints	M.H. R. Jen;L.C. Liu;Y.S. Lai
國立中山大學	2009	Structural and elastic properties of Cu6Sn5 and Cu3Sn from first-principles calculations	J. Chen;Y.S. Lai;P.F. Yang;C.Y. Ren;D.J. Huang
國立中山大學	2009	Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints	Y.S. Lai;C.R. Kao;H.C. Chang;C.L. Kao

Showing items 11-20 of 87 (9 Page(s) Totally)
<< < 1 2 3 4 5 6 7 8 9 > >>
View [10|25|50] records per page