臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

???ui.leftmenu.abouttair???
	???ui.leftmenu.explanation???

???ui.leftmenu.bartitle???
	Repositories
	Author
	Title
	Date
	???ui.leftmenu.statisticschart???
	???ui.leftmenu.realtimefacts???
	???ui.leftmenu.trend???

???index.news???
	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

???ui.leftmenu.copyrighttitle???
	???ui.leftmenu.copyrightpublisher???
	???ui.leftmenu.copyrightconference???

???ui.leftmenu.link???
	機構典藏計畫網站
	ROAR
	OpenDOAR
	SHERPA
	OAIster
	JAIRO
	Ira
	DSPACE
	RWWR
	臺大學術典藏NTU Scholars

"y s lai"???jsp.browse.items-by-author.description???

???jsp.browse.items-by-author.back???
???jsp.browse.items-by-author.order1???	???jsp.browse.items-by-author.order2???

Showing items 41-65 of 87 (4 Page(s) Totally)
<< < 1 2 3 4 > >>
View [10|25|50] records per page

Institution	Date	Title	Author
國立中山大學	2009	Process and design considerations for redistribution in wafer level chip size packaging technology for high power device applications	J. Chen;Y.S. Lai;C.A. Hsieh;C.Y. Hu
國立中山大學	2009	Why fine pitch copper wire bonding now?	B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學	2009	Nanomechanical characterization of GaN epitaxial layers	H.C. Wen;Y.S. Lai;P.F. Yang;M.H. Lin
國立中山大學	2009	Nanoindentation creep of interfacial intermetallic compounds in electronic solder joints	C.W. Su;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Application of molding compound viscoelastic model to ball grid array warpage prediction	H.W. Huang;T.C. Chiu;Y.S. Lai
國立中山大學	2009	Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber	T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai
國立中山大學	2009	Self-filling die-attach epoxy for large-die-stack applications	T.Y. Tsai;H.C. Chang;Y.S. Lai;M. Todd;D. Loskot;Q. Ji;S. Gupta;F.Y. Huang
國立中山大學	2009	Electromigration reliability characterization in ASE: A state-of-the-art review	Y.S. Lai
國立中山大學	2009	Time dependent plastic deformation behavior of interfacial intermetallic compounds in solder joints	C.W. Su;J.M. Song;B.R. Huang;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Underfill study for large dice flip chip packages	A. Lin;C.Y. Li;M.K. Shih;Y.S. Lai;B. Appelt;A. Tseng
國立中山大學	2009	Characterization of cure-dependent viscoelastic behavior for molding compound and application to package warpage simulation	T.C. Chiu;J.L. Kung;Y.S. Lai
國立中山大學	2009	Phase transformations in monocrystalline Si induced by repeated nanoindentation	Y.H. Lin;T.C. Chen;Y.S. Lai;P.F. Yang;D.L. Chen
國立中山大學	2009	Evaluation of nanomechanical properties of multi-layer SiGe-Si films	M.H. Lin;H.C. Wen;Y.S. Lai;P.F. Yang
國立中山大學	2009	Effect of trace alloying elements on the ball impact test performance of SnAgCu solder joints	Y.R. Liu;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學	2009	Crack formation on Pd-plated Cu wire/Al	Y.W. Lin;Y.T. Chiu;K.L. Lin;Y.S. Lai
國立中山大學	2009	New bending algorithm for field driven molecular	D.L. Chen;T.C. Chen;Y.S. Lai
國立中山大學	2009	Numerical examinations of thermal cycling fatiguereliability of substrate through holes	T.H. Chen;T.H. Wang;Y.S. Lai
國立中山大學	2009	Ultra-long probing needle design for digital light processing wafer testing	H.Y. Chang;M.K. Shih;Y.S. Lai
國立中山大學	2009	Process and design considerations for redistribution in wafer level chip size packaging technology for high power device applications	J. Chen;Y.S. Lai;C.A. Hsieh;C.Y. Hu
國立中山大學	2009	Why fine pitch copper wire bonding now?	B.K. Appelt;A. Tseng;Y.S. Lai
國立中山大學	2009	Nanomechanical characterization of GaN epitaxial layers	H.C. Wen;Y.S. Lai;P.F. Yang;M.H. Lin
國立中山大學	2009	Nanoindentation creep of interfacial intermetallic compounds in electronic solder joints	C.W. Su;J.M. Song;Y.S. Lai;.T. Chiu
國立中山大學	2009	Application of molding compound viscoelastic model to ball grid array warpage prediction	H.W. Huang;T.C. Chiu;Y.S. Lai
國立中山大學	2009	Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber	T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai
國立中山大學	2009	Self-filling die-attach epoxy for large-die-stack applications	T.Y. Tsai;H.C. Chang;Y.S. Lai;M. Todd;D. Loskot;Q. Ji;S. Gupta;F.Y. Huang

Showing items 41-65 of 87 (4 Page(s) Totally)
<< < 1 2 3 4 > >>
View [10|25|50] records per page

	English \| 正體中文 \| 简体中文 \| 0
	???header.visitor??? : 52928340 ???header.onlineuser??? : 822 ???header.sponsordeclaration???