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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
研討會
機構典藏系統RC7版本已
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Institution Date Title Author
美和科技大學 2012 Rapid on-site multiplex assays for total and toxigenic Microcystis using real-time PCR with microwave cell disruption A. Michinaka;H. K. Yen;Y. T. Chiu;H. W. Tsao;T. F. Lin
佛光大學 2010-07-11 Analysis and Comparison of Fish Posture by Image Processing 賴政良;S.-T. Tsai;Y.-T. Chiu
佛光大學 2010-07-11 Analysis and Comparison of Fish Posture by Image Processing 賴政良;S.-T. Tsai;Y.-T. Chiu
國立中山大學 2009 Strain rate dependence on nanoindentation responses of interfacial intermetallic compounds in electronic solder joints with Cu and Ag substrates J.M. Song;Y.L. Shen;C.W. Su;Y.S. Lai;Y.T. Chiu
國立中山大學 2009 Electromigration reliability of 96.5Sn-3Ag-0.5Cu flip-chip solder joints with Au/Ni/Cu or Cu substrate pad metallization Y.S. Lai;Y.T. Chiu;C.W. Lee
國立中山大學 2009 Alloying modification of Sn-Ag-Cu solders by manganese and titanium L.W. Lin;J.M. Song;Y.S. Lai;Y.T. Chiu;N.C. Lee;J.Y. Uan
國立中山大學 2009 Effect of trace alloying elements on the ball impact test performance of SnAgCu solder joints Y.R. Liu;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學 2009 Crack formation on Pd-plated Cu wire/Al pad interface Y.W. Lin;Y.T. Chiu;K.L. Lin;Y.S. Lai
國立中山大學 2009 Nanoindentation creep of interfacial intermetallic compounds in electronic solder joints C.W. Su;J.M. Song;Y.S. Lai;Y.T. Chiu
國立中山大學 2009 Time dependent plastic deformation behavior of interfacial intermetallic compounds in solder joints C.W. Su;J.M. Song;B.R. Huang;Y.S. Lai;Y.T. Chiu

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